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ContactIC Adapters(274)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Voltage - Rated | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Height | Width | Lead Free | Depth | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Lead Pitch | Pbfree Code | Connector Type | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Pitch | Cable Length | Body Material | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Sensing Distance | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | PCB Contact Row Spacing | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 14-35W000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2003 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | SOIC | 17.8mm | 1.58mm | Lead Free | 5 Weeks | 14 | 14 | NOT SPECIFIED | EAR99 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||
| 224-1275-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole, Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | 1kV | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 45mm | 32mm | Lead Free | 6.9mm | 8 Weeks | 453.59237g | 24 | 24 | Female | 24 | Gold | Straight | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | Glass, Polysulfone | 15.24 mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||
| 1106396-16 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 16 | 2.54mm | yes | 16 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 2 | IC SOCKET | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| LCQT-QFP0.5-52 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | ROHS3 Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 52 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.020 0.50mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||
| 1106396-14 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 14 | 2.54mm | yes | 14 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 2 | IC SOCKET | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 1111841-8 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1111841 | Through Hole | Through Hole | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2006 | /files/arieselectronics-11118418-datasheets-0138.pdf | 6 Weeks | 8 | 8 | EAR99 | UL 94V-0 | Tin | 3.175mm | e0 | 2 | IC SOCKET | MSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.020 0.50mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||
| 1107254-16 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 16 | 2.54mm | yes | 16 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 18-35W000-10-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | SOIC | 5 Weeks | 18 | 18 | 3.175mm | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||
| 228-1277-39-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 28 | 28 | Female | 28 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||||||
| 228-1277-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 28 | 28 | Female | 28 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||||
| LCQT-QFP0.5-80 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 80 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.020 0.50mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||
| 1106396-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 20 | 2.54mm | yes | 20 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 2 | IC SOCKET | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 28-505-111 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 505 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-68505110-datasheets-8557.pdf | 5 Weeks | 28 | 28 | GOLD (10) | EAR99 | SOCKET ADAPTER | 3.81mm | e4 | IC SOCKET | PLCC | PGA | Brass | 0.050 1.27mm | 0.150 3.81mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||||
| 1107254-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 18 | 2.54mm | yes | 18 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 1107254-14 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 14 | 2.54mm | yes | 14 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 218-3341-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | Lead Free | 8 Weeks | 453.59237g | 18 | 18 | Female | 18 | Gold | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||||
| 248-1282-29-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 48 | 48 | Female | 48 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||
| 28-653000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 653000 | Through Hole | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2011 | /files/arieselectronics-2865300010-datasheets-0051.pdf | 1A | 6.08mm | Contains Lead | 5 Weeks | 28 | 28 | EAR99 | UL 94V-0 | Tin | e0 | Socket Included | 2 | 15.24 mm | IC SOCKET | UL94 V-0 | PLCC | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 214-3339-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 14 | 14 | Female | 14 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||||
| 224-5248-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole, Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | 1kV | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 3m | 24.4mm | Lead Free | 6.9mm | 8 Weeks | 453.59237g | 24 | 24 | Female | 24 | Gold | Straight | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 3m | 2.54mm | 3m | Glass, Polysulfone | 7.62 mm | 3 m | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||
| 216-3340-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 16 | DIP, Socket | 16 | Female | 16 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 7.62 mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||
| 228-1277-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole, Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 50.3mm | 6.9mm | Lead Free | 32mm | 8 Weeks | 453.59237g | 28 | 28 | Female | 28 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||
| 224-1275-39-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2006 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 24 | 24 | Female | 24 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||||
| 264-4493-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole, Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 100.3mm | 6.9mm | Lead Free | 43.2mm | 8 Weeks | 64 | 64 | 64 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 1GOhm | 2.54mm | 1A | UL94 V-0 | DIP, 0.9 (22.86mm) Row Spacing | DIP, 0.9 (22.86mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||
| 228-4817-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 28 | 28 | Female | 28 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.4 (10.16mm) Row Spacing | DIP, 0.4 (10.16mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||||
| 232-1285-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 32 | 32 | Female | 32 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 1GOhm | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||
| 220-3342-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole, Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 40.1mm | 6.9mm | Lead Free | 25.4mm | 8 Weeks | 453.59237g | 20 | 20 | Female | 20 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||
| 240-1280-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 65.5mm | 6.9mm | Lead Free | 32.3mm | 8 Weeks | 453.59237g | 40 | 40 | Female | 40 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||
| 1109523 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1109523 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2007 | /files/arieselectronics-1109523-datasheets-0101.pdf | TO-8 | 10.2mm | 5.85mm | Contains Lead | 6 Weeks | 8 | 8 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | Socket Included | IC SOCKET | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | JEDEC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||
| 214-3339-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 14 | 14 | Female | 14 | Gold | Straight | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | Glass, Polysulfone | 2 | 7.62 mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm |
