Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Length | Height | Lead Free | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | JESD-609 Code | Feature | Pitch | Body Material | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
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220-3342-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 20 | 20 | Female | 20 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||
1106396-28 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 35.6mm | 2.29mm | Lead Free | 5 Weeks | No SVHC | 2.54mm | yes | 28 | 28 | Gold | EAR99 | SOCKET ADAPTER | Copper | Gold, Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | 3A | RECTANGULAR | RND PIN-SKT | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||
214-3339-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 14 | 14 | Female | 14 | Gold | Straight | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | Glass, Polysulfone | 2 | 7.62 mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||
1107254-28 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 35.6mm | 2.29mm | Lead Free | 5 Weeks | No SVHC | 2.54mm | yes | 28 | 28 | Gold | EAR99 | SOCKET ADAPTER | Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 0.7 inch | 2 | 15.24 mm | IC SOCKET | 3A | RECTANGULAR | 0.3 inch | RND PIN-SKT | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm |
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