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ContactIC Adapters(274)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Height | Width | Lead Free | Depth | Factory Lead Time | Weight | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Pitch | Body Material | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | PCB Contact Row Spacing | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 224-1275-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 45mm | 32mm | Lead Free | 6.9mm | 8 Weeks | 453.59237g | 24 | 24 | Female | 24 | Gold | Straight | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | Glass, Polysulfone | 15.24 mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||
| 24-351000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 351000 | Through Hole | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2009 | /files/arieselectronics-1635100010-datasheets-9303.pdf | 1A | 1.58mm | Lead Free | 5 Weeks | 24 | 24 | EAR99 | SOCKET ADAPTER | Tin | e0 | 2 | 7.62 mm | IC SOCKET | SSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.026 0.65mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||
| 18-351000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 351000 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-2835100011rc-datasheets-8649.pdf | 22.9mm | 1.58mm | Lead Free | 5 Weeks | 18 | yes | 18 | Gold | EAR99 | SOCKET ADAPTER | e4 | IC SOCKET | SSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.026 0.65mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 22-304504-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 304504 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | /files/arieselectronics-2230450418-datasheets-0387.pdf | Lead Free | 5 Weeks | 22 | 22 | EAR99 | SOCKET ADAPTER | 3.175mm | e0 | IC SOCKET | SOIC | DIP, 0.4 (10.16mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||
| 232-1285-29-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 32 | 32 | Female | 32 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 1GOhm | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||
| 14-35W000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/arieselectronics-2035w00011rc-datasheets-9353.pdf | SOIC | 5 Weeks | 14 | yes | 14 | EAR99 | SOCKET ADAPTER | 3.175mm | e4 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 18-35W000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/arieselectronics-2035w00011rc-datasheets-9353.pdf | SOIC | 5 Weeks | 18 | yes | 18 | EAR99 | SOCKET ADAPTER | 3.175mm | e4 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 20-350001-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 350000 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-0835000011rcp-datasheets-6604.pdf | SOIC | 25.4mm | 1.58mm | Lead Free | 5 Weeks | 20 | yes | 20 | GOLD (10) OVER NICKEL (100) | EAR99 | SOCKET ADAPTER | e4 | IC SOCKET | SOJ | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 22-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | 5 Weeks | 22 | 22 | EAR99 | e0 | IC SOCKET | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||
| 28-35W000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/arieselectronics-2035w00011rc-datasheets-9353.pdf | SOIC | Lead Free | 5 Weeks | 28 | yes | 28 | EAR99 | SOCKET ADAPTER | 3.175mm | e4 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.125 3.18mm | 0.050 1.27mm | Gold | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 12-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | SOIC | 5 Weeks | 12 | 12 | 787.4μm | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||
| 20-555000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 555000 | Surface Mount | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | Lead Free | 6 Weeks | 20 | 20 | EAR99 | SOCKET ADAPTER | e3 | IC SOCKET | SSOP | SOWIC | Brass | 0.026 0.65mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||
| 218-3341-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 18 | 18 | Female | 18 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||
| 1106396-36 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 36 | 2.54mm | yes | 36 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 2 | IC SOCKET | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 1107254-40 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 40 | 2.54mm | yes | 40 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 16-307349-11-RC-P (170 UP) | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 307349 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | /files/arieselectronics-1630734911rcp170up-datasheets-0307.pdf | 5 Weeks | 16 | Gold | PLCC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||||||||
| 7131-108-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | 6 Weeks | 8 | 3.175mm | HB2E Relay | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||
| 16-350000-10-HT | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 350000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2005 | /files/arieselectronics-1435000010ht-datasheets-0250.pdf | 6 Weeks | 16 | 16 | Tin | Straight | EAR99 | SOCKET ADAPTER | POLYAMIDE | 3.175mm | High Temperature | IC SOCKET | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | Polyimide (PI) | |||||||||||||||||||||||||||||||||||||
| 24-650000-10-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 650000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2010 | /files/arieselectronics-2465000010-datasheets-8346.pdf | SOIC | 5 Weeks | 24 | 3.175mm | SOIC | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||
| 1106396-40 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 40 | 2.54mm | yes | 40 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 2 | IC SOCKET | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 10-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | SOIC | 5 Weeks | 10 | 10 | 787.4μm | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||
| 228-4817-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 28 | 28 | 28 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.4 (10.16mm) Row Spacing | DIP, 0.4 (10.16mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||
| 20-301550-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 301550 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-2030155020-datasheets-0273.pdf | 5 Weeks | 20 | 32 | EAR99 | SOCKET ADAPTER | 762μm | e0 | IC SOCKET | SOIC | PLCC | Brass | 0.050 1.27mm | 0.030 0.76mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||
| 24-350000-10-HT | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 350000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2005 | /files/arieselectronics-1435000010ht-datasheets-0250.pdf | 8 Weeks | 24 | no | 24 | Tin | EAR99 | SOCKET ADAPTER | POLYAMIDE | 3.175mm | e0 | High Temperature | IC SOCKET | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | Polyimide (PI) | ||||||||||||||||||||||||||||||||||||
| 24-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | 5 Weeks | 24 | 24 | EAR99 | 787.4μm | e0 | IC SOCKET | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||
| 68-505-110-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 505 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2011 | /files/arieselectronics-68505110-datasheets-8557.pdf | Lead Free | 5 Weeks | 68 | 68 | EAR99 | 3.81mm | e0 | IC SOCKET | PLCC | PGA | Brass | 0.050 1.27mm | 0.150 3.81mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||
| 26-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | SOIC | 5 Weeks | 26 | 26 | 787.4μm | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||
| 16-35W000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2003 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | 20.3mm | 1.58mm | Lead Free | 5 Weeks | 16 | 16 | EAR99 | e0 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||
| 224-5248-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | Lead Free | 8 Weeks | 24 | 24 | Female | 24 | Gold | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||
| 08-305479-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 305479 | Through Hole | Through Hole | Box | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | /files/arieselectronics-1109814-datasheets-1511.pdf | Lead Free | 5 Weeks | 8 | 8 | EAR99 | 3.175mm | e3 | IC SOCKET | SOIC | JEDEC | Brass | 0.050 1.27mm | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass |
