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ContactIC Adapters(274)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Voltage - Rated | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Height | Width | Lead Free | Depth | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Pitch | Body Material | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 20-354W00-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 25.4mm | 1.58mm | Lead Free | 5 Weeks | 20 | 20 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||
| 14-354W00-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 17.8mm | 1.58mm | Lead Free | 5 Weeks | 14 | 14 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||
| 28-650000-10-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 650000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2010 | /files/arieselectronics-2465000010-datasheets-8346.pdf | SOIC | 35.6mm | 1.58mm | 5 Weeks | 28 | 28 | SOIC | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||
| 18-354000-21-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1835400021rc-datasheets-0533.pdf | 3A | 5 Weeks | 18 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 2.286mm | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.089 2.28mm | 0.050 1.27mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||
| 18-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | 5 Weeks | 18 | 18 | EAR99 | 787.4μm | e0 | IC SOCKET | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||
| 20-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 3A | 5 Weeks | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||
| 224-1275-29-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 24 | 24 | Female | 24 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||
| 16-35W000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2008 | /files/arieselectronics-2035w00011rc-datasheets-9353.pdf | SOIC | Lead Free | 5 Weeks | 16 | yes | 16 | EAR99 | SOCKET ADAPTER | 3.175mm | e4 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 32-653000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 653000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2011 | /files/arieselectronics-2865300010-datasheets-0051.pdf | 40.6mm | 6.08mm | Contains Lead | 5 Weeks | 32 | 32 | EAR99 | UL 94V-0 | e0 | Socket Included | IC SOCKET | 1A | UL94 V-0 | PLCC | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||
| 16-307349-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 307349 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1630734911rcp170up-datasheets-0307.pdf | 5 Weeks | 16 | Gold | EAR99 | 3.175mm | IC SOCKET | PLCC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||||||
| 14-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2011 | /files/arieselectronics-1435400010-datasheets-0450.pdf | 3A | 5 Weeks | 14 | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 14-354000-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-1435400010-datasheets-0450.pdf | 3A | 5 Weeks | 14 | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| LCQT-QFP0.5-60 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 60 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.020 0.50mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 32-650000-10-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 650000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2013 | SOIC | 5 Weeks | 32 | SOIC | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||||||||||
| 18-351000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 351000 | Through Hole | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2009 | /files/arieselectronics-1635100010-datasheets-9303.pdf | 1A | 1.58mm | Contains Lead | 5 Weeks | 18 | 18 | EAR99 | SOCKET ADAPTER | Tin | e0 | 2 | 7.62 mm | IC SOCKET | SSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.026 0.65mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||
| LCQT-QFP0.5-40-1 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 40 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.020 0.50mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 242-1293-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 42 | 42 | Female | 42 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 1.778mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.070 1.78mm | 0.130 3.30mm | 0.070 1.78mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||
| 232-1285-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | 1kV | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 55.2mm | 32mm | Lead Free | 6.9mm | 8 Weeks | 32 | 32 | Female | 32 | Gold | Straight | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 1GOhm | Closed Frame | 2.54mm | Glass, Polysulfone | 15.24 mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||
| 1107254-24 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 30.5mm | 2.29mm | Lead Free | 5 Weeks | No SVHC | 2.54mm | yes | 24 | 24 | Gold | EAR99 | SOCKET ADAPTER | Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 0.7 inch | 2 | 15.24 mm | IC SOCKET | 3A | RECTANGULAR | 0.3 inch | RND PIN-SKT | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||
| 242-1281-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 42 | 42 | Female | 42 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||||||
| 16-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2012 | 3A | 5 Weeks | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 24-351000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 351000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-2865300010-datasheets-0051.pdf | 5 Weeks | No SVHC | 24 | yes | 24 | Gold | EAR99 | SOCKET ADAPTER | 3.175mm | e4 | 7.62 mm | IC SOCKET | SSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.026 0.65mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| LCQT-QFP0.5-40 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 40 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.020 0.50mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 28-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | 5 Weeks | 28 | 28 | EAR99 | SOCKET ADAPTER | 787.4μm | e3 | IC SOCKET | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||||
| 242-1281-29-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 42 | 42 | Female | 42 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||||||||
| 224-1275-09-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | 45mm | 32mm | Lead Free | 6.9mm | 8 Weeks | 453.59237g | 24 | 24 | Female | 24 | Gold | Straight | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | Glass, Polysulfone | 15.24 mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||||||
| 24-351000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 351000 | Through Hole | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2009 | /files/arieselectronics-1635100010-datasheets-9303.pdf | 1A | 1.58mm | Lead Free | 5 Weeks | 24 | 24 | EAR99 | SOCKET ADAPTER | Tin | e0 | 2 | 7.62 mm | IC SOCKET | SSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.026 0.65mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||
| 18-351000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 351000 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-2835100011rc-datasheets-8649.pdf | 22.9mm | 1.58mm | Lead Free | 5 Weeks | 18 | yes | 18 | Gold | EAR99 | SOCKET ADAPTER | e4 | IC SOCKET | SSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.026 0.65mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||
| 22-304504-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 304504 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | /files/arieselectronics-2230450418-datasheets-0387.pdf | Lead Free | 5 Weeks | 22 | 22 | EAR99 | SOCKET ADAPTER | 3.175mm | e0 | IC SOCKET | SOIC | DIP, 0.4 (10.16mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||
| 232-1285-29-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 32 | 32 | Female | 32 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 1GOhm | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm |
