Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Series Mount Mounting Type Operating Temperature Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature Voltage - Rated RoHS Status Published Datasheet Current Rating Package / Case Length Height Width Lead Free Material Depth Factory Lead Time Weight REACH SVHC Number of Pins Lead Pitch Pbfree Code Number of Positions Gender Number of Contacts Contact Finish - Mating Orientation Flammability Rating ECCN Code Additional Feature Contact Material Contact Plating Housing Material Lead Length JESD-609 Code Feature Pitch Body Material Number of Rows Row Spacing Device Socket Type Current Rating (Amps) Material Flammability Rating Convert From (Adapter End) Convert To (Adapter End) Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Board Material
68-505-110-RC 68-505-110-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 505 Through Hole Through Hole 1 (Unlimited) Solder ROHS3 Compliant 2013 /files/arieselectronics-68505110-datasheets-8557.pdf PLCC 5 Weeks 68 3.81mm PLCC PGA Brass 0.050 1.27mm 0.150 3.81mm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
95-132I25 95-132I25 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 95-132I25 Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2006 /files/arieselectronics-95132i25-datasheets-0669.pdf 34.3mm 2.39mm Contains Lead 5 Weeks 132 95 132 Tin EAR99 SOCKET ADAPTER e3 IC SOCKET QFP PGA Copper Brass 0.025 0.64mm 0.125 3.18mm 0.100 2.54mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
14-354000-11-RC 14-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 354000 Surface Mount Surface Mount 1 (Unlimited) Solder ROHS3 Compliant 2006 /files/arieselectronics-1835400021rc-datasheets-0533.pdf 3A Polyester 5 Weeks No SVHC 14 yes 14 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Copper Polyamide (PA46), Nylon 4/6, Glass Filled 762μm e4 7.62 mm IC SOCKET UL94 V-0 DIP, 0.3 (7.62mm) Row Spacing SOIC 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.030 0.76mm 0.050 1.27mm 10.0μin 0.25μm
32-653000-11-RC 32-653000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 653000 Through Hole Through Hole 1 (Unlimited) Solder ROHS3 Compliant 2006 /files/arieselectronics-2865300010-datasheets-0051.pdf 1A Lead Free 5 Weeks No SVHC 32 yes 32 UL94 V-0 EAR99 UL 94V-0 3.175mm e4 Socket Included 15.24 mm IC SOCKET UL94 V-0 PLCC DIP, 0.6 (15.24mm) Row Spacing Brass 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm Gold 10.0μin 0.25μm FR4 Epoxy Glass
24-35W000-11-RC 24-35W000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 35W000 Through Hole Through Hole 1 (Unlimited) Solder ROHS3 Compliant 2012 /files/arieselectronics-2035w00011rc-datasheets-9353.pdf 5 Weeks 24 yes 24 EAR99 SOCKET ADAPTER 3.175mm e4 IC SOCKET SOIC-W DIP, 0.3 (7.62mm) Row Spacing Brass 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm Gold 10.0μin 0.25μm FR4 Epoxy Glass
95-132I25-P 95-132I25-P Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 95-132I25 Through Hole Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2009 /files/arieselectronics-95132i25-datasheets-0669.pdf 5 Weeks 132 132 Tin EAR99 SOCKET ADAPTER 3.175mm e3 IC SOCKET QFP PGA Copper Brass 0.025 0.64mm 0.125 3.18mm 0.100 2.54mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
264-1300-29-0602J 264-1300-29-0602J Artery
RFQ

Min: 1

Mult: 1

0 0x0x0 download Textool™ Through Hole Through Hole -55°C~125°C 1 (Unlimited) Solder 150°C -55°C RoHS Compliant 2011 /files/3m-2163340190602j-datasheets-9985.pdf 1A 72.5mm 6.9mm Lead Free 8 Weeks 64 64 Female 64 Gold UL94 V-0 Copper Gold Polysulfone (PSU), Glass Filled Closed Frame 2.54mm 1A UL94 V-0 DIP, 0.8 (20.32mm) Row Spacing DIP, 0.8 (20.32mm) Row Spacing 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.070 1.78mm 0.130 3.30mm 0.070 1.78mm Gold 30.0μin 0.76μm
32-652000-11-RC 32-652000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 652000 Through Hole Through Hole 1 (Unlimited) Solder ROHS3 Compliant 2012 /files/arieselectronics-2865300010-datasheets-0051.pdf 1A Lead Free 5 Weeks 32 yes 32 EAR99 UL 94V-0 3.175mm e4 IC SOCKET PLCC DIP, 0.6 (15.24mm) Row Spacing Brass 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm Gold 10.0μin 0.25μm FR4 Epoxy Glass
14-666000-00 14-666000-00 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 666000 Surface Mount Surface Mount 1 (Unlimited) Solder 105°C -55°C Non-RoHS Compliant 2006 /files/arieselectronics-1666600000-datasheets-9487.pdf 5 Weeks 14 14 EAR99 UL 94V-0 Tin 2.032mm e0 2 IC SOCKET SOIC SOWIC Brass 0.050 1.27mm 0.080 2.03mm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
LCQT-QFP0.65-80 LCQT-QFP0.65-80
RFQ

Min: 1

Mult: 1

0 0x0x0
240-3639-09-0602J 240-3639-09-0602J Artery
RFQ

Min: 1

Mult: 1

0 0x0x0 download Textool™ Through Hole Through Hole -55°C~125°C 1 (Unlimited) Solder 150°C -55°C RoHS Compliant 2001 /files/3m-2163340190602j-datasheets-9985.pdf 1A Lead Free 8 Weeks 40 40 Female 40 Gold Straight UL94 V-0 Copper Gold Polysulfone (PSU), Glass Filled Closed Frame 2.54mm Glass, Polysulfone 25.4 mm 1A UL94 V-0 DIP, 1.0 (25.40mm) Row Spacing DIP, 1.0 (25.40mm) Row Spacing 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.130 3.30mm 0.100 2.54mm Gold 30.0μin 0.76μm
24-651000-10 24-651000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 651000 Through Hole Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2006 /files/arieselectronics-1665100010-datasheets-0581.pdf 1A 5 Weeks 24 36 EAR99 SOCKET ADAPTER 3.683mm e0 IC SOCKET SSOP DIP, 0.6 (15.24mm) Row Spacing Brass 0.026 0.65mm 0.145 3.68mm 0.100 2.54mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
28-651000-10 28-651000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 651000 Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2006 /files/arieselectronics-1665100010-datasheets-0581.pdf 35.6mm 1.58mm Contains Lead 5 Weeks 28 28 NOT SPECIFIED EAR99 SOCKET ADAPTER e3 IC SOCKET 1A SSOP DIP, 0.6 (15.24mm) Row Spacing Brass 0.026 0.65mm 0.145 3.68mm 0.100 2.54mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
264-4493-09-0602J 264-4493-09-0602J Artery
RFQ

Min: 1

Mult: 1

0 0x0x0 download Textool™ Through Hole Through Hole -55°C~125°C 1 (Unlimited) Solder 150°C -55°C 1kV RoHS Compliant 2001 /files/3m-2163340190602j-datasheets-9985.pdf 1A 100.3mm 43.2mm Lead Free 6.9mm 8 Weeks 64 64 Female 64 Gold Straight UL94 V-0 Copper Gold Polysulfone (PSU), Glass Filled 2.54mm Glass, Polysulfone 22.86 mm 1A UL94 V-0 DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.070 1.78mm 0.130 3.30mm 0.070 1.78mm Gold 300.0μin 7.62μm
24-354000-20 24-354000-20 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 354000 Surface Mount Surface Mount 1 (Unlimited) Solder 105°C -55°C ROHS3 Compliant 2006 /files/arieselectronics-1435400010-datasheets-0450.pdf 3A 5 Weeks 24 24 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Gold, Tin Polyamide (PA46), Nylon 4/6, Glass Filled e3 2 7.62 mm IC SOCKET UL94 V-0 DIP, 0.3 (7.62mm) Row Spacing SOIC 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.050 1.27mm 10.0μin 0.25μm
28-354000-21-RC 28-354000-21-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 354000 Surface Mount Surface Mount 1 (Unlimited) Solder ROHS3 Compliant 2009 /files/arieselectronics-1835400021rc-datasheets-0533.pdf 3A 5 Weeks 28 yes 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 2.286mm e4 IC SOCKET UL94 V-0 DIP, 0.3 (7.62mm) Row Spacing SOIC 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.100 2.54mm 10.0μin 0.25μm
28-352000-10 28-352000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 352000 Through Hole Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2007 /files/arieselectronics-2035300010-datasheets-0619.pdf 1A 5 Weeks 28 28 NOT SPECIFIED EAR99 RYTON 3.175mm e3 IC SOCKET PLCC DIP, 0.3 (7.62mm) Row Spacing Brass 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm Tin-Lead FR4 Epoxy Glass
PA-TS1D6SM18-56 PA-TS1D6SM18-56 Logical Systems Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Through Hole Not Applicable Solder RoHS Compliant 2006 7 Weeks 56 TSOP DIP 0.020 0.50mm 0.125 3.18mm 0.100 2.54mm
242-1293-29-0602J 242-1293-29-0602J Artery
RFQ

Min: 1

Mult: 1

0 0x0x0 download Textool™ Through Hole Through Hole -55°C~125°C 1 (Unlimited) Solder 150°C -55°C RoHS Compliant 2011 /files/3m-2163340190602j-datasheets-9985.pdf 1A Lead Free 9 Weeks 42 42 Female 42 Gold UL94 V-0 Copper Gold Polysulfone (PSU), Glass Filled Closed Frame 1.778mm 1A UL94 V-0 DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.070 1.78mm 0.130 3.30mm 0.070 1.78mm Gold 30.0μin 0.76μm
240-1280-09-0602J 240-1280-09-0602J Artery
RFQ

Min: 1

Mult: 1

0 0x0x0 download Textool™ Through Hole Through Hole -55°C~125°C 1 (Unlimited) Solder 150°C -55°C 1kV RoHS Compliant 2001 /files/3m-2163340190602j-datasheets-9985.pdf 1A 65.5mm 32.3mm Lead Free 6.9mm 8 Weeks 453.59237g 40 40 Female 40 Gold Straight UL94 V-0 Copper Gold Polysulfone (PSU), Glass Filled 2.54mm Glass, Polysulfone 15.24 mm 1A UL94 V-0 DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.130 3.30mm 0.100 2.54mm Gold 30.0μin 0.76μm
264-1300-09-0602J 264-1300-09-0602J Artery
RFQ

Min: 1

Mult: 1

0 0x0x0 download Textool™ Through Hole Through Hole -55°C~125°C 1 (Unlimited) Solder 150°C -55°C 1kV RoHS Compliant 2001 /files/3m-2163340190602j-datasheets-9985.pdf 1A 72.5mm 38.5mm Lead Free 6.9mm 8 Weeks 64 64 Female 64 Gold Straight UL94 V-0 Copper Gold Polysulfone (PSU), Glass Filled Closed Frame 1.78mm Glass, Polysulfone 20.32 mm 1A UL94 V-0 DIP, 0.8 (20.32mm) Row Spacing DIP, 0.8 (20.32mm) Row Spacing 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.070 1.78mm 0.130 3.30mm 0.070 1.78mm Gold 30.0μin 0.76μm
20-353000-10 20-353000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 353000 Through Hole Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2006 /files/arieselectronics-2035300010-datasheets-0619.pdf 1A 5 Weeks 20 20 Tin-Lead UL94 V-0 EAR99 Lead, Tin RYTON 3.175mm e3 Socket Included IC SOCKET UL94 V-0 PLCC DIP, 0.3 (7.62mm) Row Spacing 200.0μin 5.08μm Phosphor Bronze Brass 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm FR4 Epoxy Glass
24-354000-11-RC 24-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 354000 Surface Mount Surface Mount 1 (Unlimited) Solder ROHS3 Compliant 2007 /files/arieselectronics-1835400021rc-datasheets-0533.pdf 3A 5 Weeks 24 yes 24 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 762μm e4 IC SOCKET UL94 V-0 DIP, 0.3 (7.62mm) Row Spacing SOIC 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.030 0.76mm 0.050 1.27mm 10.0μin 0.25μm
24-650000-11-RC-P 24-650000-11-RC-P Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 650000 Through Hole Through Hole 1 (Unlimited) Solder ROHS3 Compliant 2009 /files/arieselectronics-2865000011rc-datasheets-8333.pdf 5 Weeks 24 Gold Gold 3.175mm SOIC DIP, 0.6 (15.24mm) Row Spacing Brass 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm Gold 10.0μin 0.25μm FR4 Epoxy Glass
228-1277-29-0602J 228-1277-29-0602J Artery
RFQ

Min: 1

Mult: 1

0 0x0x0 download Textool™ Through Hole Through Hole -55°C~125°C 1 (Unlimited) Solder 150°C -55°C RoHS Compliant 2011 /files/3m-2163340190602j-datasheets-9985.pdf 1A Lead Free 8 Weeks 28 28 28 Gold UL94 V-0 Copper Gold Polysulfone (PSU), Glass Filled 2.54mm 1A UL94 V-0 DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.130 3.30mm 0.100 2.54mm Gold 30.0μin 0.76μm
20-651000-10 20-651000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 651000 Through Hole Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2006 /files/arieselectronics-1665100010-datasheets-0581.pdf 1A 5 Weeks 20 20 NOT SPECIFIED EAR99 SOCKET ADAPTER 3.683mm e3 IC SOCKET SSOP DIP, 0.6 (15.24mm) Row Spacing Brass 0.026 0.65mm 0.145 3.68mm 0.100 2.54mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
28-652000-11-RC 28-652000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 652000 Through Hole Through Hole 1 (Unlimited) Solder ROHS3 Compliant 2012 /files/arieselectronics-2865300010-datasheets-0051.pdf 1A Lead Free 5 Weeks 28 yes 28 EAR99 UL 94V-0 3.175mm e4 IC SOCKET PLCC DIP, 0.6 (15.24mm) Row Spacing Brass 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm Gold 10.0μin 0.25μm FR4 Epoxy Glass
28-555000-00 28-555000-00 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 555000 Surface Mount Surface Mount 1 (Unlimited) Solder Non-RoHS Compliant 2006 /files/arieselectronics-2855500000-datasheets-0637.pdf 6 Weeks 28 28 EAR99 SOCKET ADAPTER e3 IC SOCKET SSOP SOWIC Brass 0.026 0.65mm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass
20-354000-11-RC 20-354000-11-RC Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 354000 Surface Mount Surface Mount 1 (Unlimited) Solder ROHS3 Compliant 2009 /files/arieselectronics-1835400021rc-datasheets-0533.pdf 3A Glass, Polyester, Thermoplastic 5 Weeks No SVHC 20 2.54mm yes 20 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Copper Polyamide (PA46), Nylon 4/6, Glass Filled 762μm e4 7.62 mm IC SOCKET UL94 V-0 DIP, 0.3 (7.62mm) Row Spacing SOIC 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.030 0.76mm 0.050 1.27mm 10.0μin 0.25μm
14-651000-10 14-651000-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download Correct-A-Chip® 651000 Through Hole Through Hole 1 (Unlimited) Solder Non-RoHS Compliant 2006 /files/arieselectronics-1665100010-datasheets-0581.pdf 1A 5 Weeks 14 14 NOT SPECIFIED EAR99 SOCKET ADAPTER 3.683mm e3 IC SOCKET SSOP DIP, 0.6 (15.24mm) Row Spacing Brass 0.026 0.65mm 0.145 3.68mm 0.100 2.54mm Tin-Lead 200.0μin 5.08μm FR4 Epoxy Glass

In Stock

Please send RFQ , we will respond immediately.