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| Parameters | |
|---|---|
| Contact Plating | Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | ISOWATT218FX |
| Number of Pins | 3 |
| Transistor Element Material | SILICON |
| Operating Temperature | 150°C TJ |
| Packaging | Tube |
| Series | PowerMESH™ |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| ECCN Code | EAR99 |
| Resistance | 9Ohm |
| Subcategory | FET General Purpose Power |
| Technology | MOSFET (Metal Oxide) |
| Base Part Number | STFW |
| Pin Count | 3 |
| Number of Elements | 1 |
| Power Dissipation-Max | 63W Tc |
| Element Configuration | Single |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 63W |
| Case Connection | ISOLATED |
| Turn On Delay Time | 24 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 9 Ω @ 1.3A, 10V |
| Vgs(th) (Max) @ Id | 5V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 939pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 2.5A Tc |
| Gate Charge (Qg) (Max) @ Vgs | 29.3nC @ 10V |
| Rise Time | 47ns |
| Drain to Source Voltage (Vdss) | 1500V |
| Drive Voltage (Max Rds On,Min Rds On) | 10V |
| Vgs (Max) | ±30V |
| Fall Time (Typ) | 61 ns |
| Turn-Off Delay Time | 45 ns |
| Continuous Drain Current (ID) | 2.5A |
| Threshold Voltage | 4V |
| Gate to Source Voltage (Vgs) | 30V |
| Drain to Source Breakdown Voltage | 1.5kV |
| Avalanche Energy Rating (Eas) | 450 mJ |
| Height | 26.7mm |
| Length | 15.7mm |
| Width | 5.7mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 7 months ago) |
STFW3N150 is a type of PowerMESH power MOSFET developed by STMicroelectronics. It is designed utilizing the STMicroelectronics consolidated strip-layout-based MESH OVERLAY process. It can be found in the TO-3PF, H2PAK-2, TO-220, or TO247 packages with the purpose of saving board space. Based on its 100% avalanche tested, intrinsic capacitances and Qg minimized, and high-speed switching, STFW3N150 power MOSFET is well suited for various applications.
100% avalanche tested
Intrinsic capacitances and Qg minimized
High-speed switching
Fully isolated TO-3PF plastic package, creepage distance path is 5.4 mm (typ.)
Switching applications
Please send RFQ , we will respond immediately.