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| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-PowerVDFN |
| Number of Pins | 8 |
| Transistor Element Material | SILICON |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2010 |
| Series | HEXFET® |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 5 |
| ECCN Code | EAR99 |
| Resistance | 3.2MOhm |
| Terminal Finish | Matte Tin (Sn) |
| Additional Feature | HIGH RELIABILITY |
| Subcategory | FET General Purpose Power |
| Technology | MOSFET (Metal Oxide) |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | R-PDSO-N5 |
| Number of Elements | 1 |
| Configuration | SINGLE WITH BUILT-IN DIODE |
| Power Dissipation-Max | 3.6W Ta 156W Tc |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 156W |
| Case Connection | DRAIN |
| Turn On Delay Time | 21 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 2.4m Ω @ 50A, 10V |
| Vgs(th) (Max) @ Id | 2.5V @ 150μA |
| Input Capacitance (Ciss) (Max) @ Vds | 4730pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 29A Ta 100A Tc |
| Gate Charge (Qg) (Max) @ Vgs | 82nC @ 10V |
| Rise Time | 54ns |
| Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
| Vgs (Max) | ±16V |
| Fall Time (Typ) | 21 ns |
| Turn-Off Delay Time | 31 ns |
| Continuous Drain Current (ID) | 100A |
| Gate to Source Voltage (Vgs) | 16V |
| Drain Current-Max (Abs) (ID) | 29A |
| Drain to Source Breakdown Voltage | 40V |
| Pulsed Drain Current-Max (IDM) | 400A |
| Avalanche Energy Rating (Eas) | 360 mJ |
| Height | 990.6μm |
| Length | 6.1468mm |
| Width | 5.15mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
The IRLH5034TRPBF is a MICRO-8-sized device with a 0.7 mm profile that combines the newest HEXFET? Power MOSFET Silicon technology with novel DirectFETTM packaging to produce the lowest on-state resistance in a MICRO-8-sized device. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques when application note AN-1035 addressing manufacturing methods and procedures is followed.
Low Thermal Resistance to PCB (W08°C/W) measured to 100% Rq
Low Visibility (M 0.9 mm)
Standard Pinout in the Industry
Compatible with Current Surface Mounting Methodologies
Compliant with RoHS MSL1 Industrial Qualification has no lead, bromide, or halogen.
? Synchronous Rectification on the Secondary Side
? Inverters for DC Motors (Inverters for DC Motors)
? Applications for DC-DC Bricks
? Converting Boost
Please send RFQ , we will respond immediately.