IRF6712STRPBF

IRF6712STRPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF6712STRPBF
  • Package: DirectFET™ Isometric SQ
  • Datasheet: pdf
  • Stock: 2641
  • Description: IRF6712STRPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DirectFET™ Isometric SQ
Number of Pins 6
Transistor Element Material SILICON
Operating Temperature -40°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2009
Series HEXFET®
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Resistance 4.9MOhm
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Terminal Position BOTTOM
JESD-30 Code R-XBCC-N2
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max 2.2W Ta 36W Tc
Operating Mode ENHANCEMENT MODE
Power Dissipation 36W
Case Connection DRAIN
Turn On Delay Time 11 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 4.9m Ω @ 17A, 10V
Vgs(th) (Max) @ Id 2.4V @ 50μA
Input Capacitance (Ciss) (Max) @ Vds 1570pF @ 13V
Current - Continuous Drain (Id) @ 25°C 17A Ta 68A Tc
Gate Charge (Qg) (Max) @ Vgs 18nC @ 4.5V
Rise Time 40ns
Drive Voltage (Max Rds On,Min Rds On) 4.5V 10V
Vgs (Max) ±20V
Fall Time (Typ) 12 ns
Turn-Off Delay Time 14 ns
Continuous Drain Current (ID) 17A
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 25V
Height 506μm
Length 4.826mm
Width 3.95mm

IRF6712STRPBF Description


IRF6712STRPBF is a kind of HEXFET? power MOSFET developed by Infineon Technologies. The lowest on-state resistance in a package can be realized based on the advanced DirectFET? packaging that can also make dual-sided cooling possible to maximize thermal transfer in power systems. It is able to provide low resistance, low charge, as well as low conduction and switching losses. 



IRF6712STRPBF Features


  • Low conduction and switching losses

  • Ultra-low package inductance

  • Dual-sided cooling compatible

  • Advanced DirectFET? packaging

  • Low on-state resistance



IRF6712STRPBF Applications


  • Sync.FET and some Control FET application

  • High-efficiency DC-DC converters


In Stock

Please send RFQ , we will respond immediately.