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| Parameters | |
|---|---|
| Transistor Element Material | SILICON |
| Operating Temperature | -55°C~175°C TJ |
| Packaging | Tube |
| Published | 2002 |
| Series | HEXFET® |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| ECCN Code | EAR99 |
| Resistance | 3.6Ohm |
| Additional Feature | AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE |
| Subcategory | FET General Purpose Power |
| Voltage - Rated DC | 40V |
| Technology | MOSFET (Metal Oxide) |
| Current Rating | 210A |
| Number of Elements | 1 |
| Power Dissipation-Max | 330W Tc |
| Element Configuration | Single |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 330W |
| Case Connection | DRAIN |
| Turn On Delay Time | 15 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 3.6m Ω @ 130A, 10V |
| Vgs(th) (Max) @ Id | 4V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 5890pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 210A Tc |
| Gate Charge (Qg) (Max) @ Vgs | 200nC @ 10V |
| Rise Time | 140ns |
| Drive Voltage (Max Rds On,Min Rds On) | 10V |
| Vgs (Max) | ±20V |
| Fall Time (Typ) | 110 ns |
| Turn-Off Delay Time | 62 ns |
| Continuous Drain Current (ID) | 210A |
| Threshold Voltage | 4V |
| JEDEC-95 Code | TO-220AB |
| Gate to Source Voltage (Vgs) | 20V |
| Drain Current-Max (Abs) (ID) | 75A |
| Drain to Source Breakdown Voltage | 40V |
| Pulsed Drain Current-Max (IDM) | 850A |
| Dual Supply Voltage | 40V |
| Avalanche Energy Rating (Eas) | 460 mJ |
| Nominal Vgs | 4 V |
| Height | 16.51mm |
| Length | 10.668mm |
| Width | 4.826mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 12 Weeks |
| Contact Plating | Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | TO-220-3 |
| Number of Pins | 3 |
To achieve exceptionally low onresistance per silicon area, the IRF2204PBF MOSFET employs the most advanced processing techniques. A 175°C junction working temperature, quick switching speed, and increased repeating avalanche rating are all included in this design. These characteristics combine to make this design a highly efficient and dependable device that may be used in a range of applications.
Technology for Advanced Processes
On-Resistance is really low.
Rating for Dynamic dv/dt
Operating Temperature: 175°C
Quick Switching
Avalanche Repetitive Tjmax is the maximum amount of time allowed.
Le
IRF2204PBF is intended for general use and can be used in a variety of situations.
Please send RFQ , we will respond immediately.