IRF1407PBF

IRF1407PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF1407PBF
  • Package: TO-220-3
  • Datasheet: pdf
  • Stock: 3163
  • Description: IRF1407PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Factory Lead Time 12 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-220-3
Number of Pins 3
Supplier Device Package TO-220AB
Operating Temperature -55°C~175°C TJ
Packaging Tube
Published 2001
Series HEXFET®
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Resistance 7.8Ohm
Max Operating Temperature 175°C
Min Operating Temperature -55°C
Voltage - Rated DC 75V
Technology MOSFET (Metal Oxide)
Current Rating 130A
Number of Elements 1
Power Dissipation-Max 330W Tc
Element Configuration Single
Power Dissipation 330W
Turn On Delay Time 11 ns
FET Type N-Channel
Rds On (Max) @ Id, Vgs 7.8mOhm @ 78A, 10V
Vgs(th) (Max) @ Id 4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 5600pF @ 25V
Current - Continuous Drain (Id) @ 25°C 130A Tc
Gate Charge (Qg) (Max) @ Vgs 250nC @ 10V
Drain to Source Voltage (Vdss) 75V
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
Fall Time (Typ) 140 ns
Turn-Off Delay Time 150 ns
Continuous Drain Current (ID) 130A
Threshold Voltage 4V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 75V
Dual Supply Voltage 75V
Input Capacitance 5.6nF
Drain to Source Resistance 7.8mOhm
Rds On Max 7.8 mΩ
Nominal Vgs 4 V
Height 16.51mm
Length 10.668mm
Width 4.826mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free


IRF1407PBF Description


Infineon Technologies manufactures the IRF1407PBF HEXFET? Power MOSFET. The maximum power dissipation and operating temperature of the IRF1407PBF are both 330W. It is packaged in the TO-220-3 format. This HEXFET? Power MOSFET Stripe Planar design employs the most advanced processing techniques to provide incredibly low on-resistance per silicon area. A 175°C junction operating temperature, quick switching speed, and increased repeating avalanche rating are all attributes of this HEXFET power MOSFET. These features combine to make this design a highly efficient and dependable device that can be used in a wide range of applications.



IRF1407PBF Features


Advanced Process Technology

Ultra-Low On-Resistance

Dynamic DV/DT Rating

175°C Operating Temperature

Fast Switching


 

IRF1407PBF Applications


Power Management

Industrial

DC-DC Conversion

Switch application


In Stock

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