Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Propagation Delay | Architecture | Frequency (Max) | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Registers | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Clock Frequency | Organization | Number of Gates | Number of Macro Cells | UV Erasable | Output Function | Core Processor | Connectivity | Number of Logic Elements/Cells | Number of Logic Blocks (LABs) | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Number of CLBs | JTAG BST | Combinatorial Delay of a CLB-Max | In-System Programmable |
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XCZU19EG-1FFVC1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 512 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX110-3FF1760C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | 1999 | https://pdf.utmel.com/r/datasheets/xilinx-xc5vlx1103ff1760c-datasheets-7387.pdf | FCBGA | 42.5mm | 42.5mm | 1V | 6 Weeks | 1760 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 800 | 576kB | 3 | 800 | 1412MHz | 110592 | 8640 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU17EG-1FFVE1924I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1924-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 668 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6SLX45-L1FG676I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 (168 Hours) | 100°C | -40°C | CMOS | 2.44mm | RoHS Compliant | BGA | 27mm | 27mm | 1V | 676 | 676 | no | 3A991.D | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 676 | INDUSTRIAL | 1.05V | 30 | Field Programmable Gate Arrays | 12.5/3.3V | Not Qualified | 358 | 261kB | 358 | 54576 | 43661 | 3411 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU15EG-2FFVB1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VFX100T-3FFG1738C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 42.5mm | 42.5mm | 1V | 1738 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 680 | 1MB | 3 | 680 | 1412MHz | 102400 | 8000 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU17EG-3FFVD1760E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1760-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 308 | DMA, WDT | 256KB | MCU, FPGA | 600MHz, 667MHz, 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX20T-2FF323I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | RoHS Compliant | FCBGA | 19mm | 19mm | 1V | 323 | 323 | EAR99 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 323 | 1.05V | 30 | Field Programmable Gate Arrays | Not Qualified | 172 | 117kB | 2 | 172 | 19968 | 1560 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU11EG-L1FFVC1156I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 1156-BBGA, FCBGA | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B1156 | 360 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9536-6CS48C | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z015-2CLG485I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | Surface Mount | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 766MHz | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 484-LFBGA, CSPBGA | 10 Weeks | 485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | Copper, Silver, Tin | 766MHz | 485-CSBGA (19x19) | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | 766MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 74K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC9536XL4VQ64C | Xilinx |
Min: 1 Mult: 1 |
3 | CMOS | 1.2mm | Non-RoHS Compliant | 10mm | 10mm | 64 | EAR99 | 36 MACROCELLS | 8542.39.00.01 | e0 | TIN LEAD | YES | QUAD | GULL WING | 245 | 3.3V | 0.5mm | 64 | COMMERCIAL | 70°C | 3.6V | 3V | 30 | Not Qualified | S-PQFP-G64 | 36 | 4 ns | 200MHz | 0 DEDICATED INPUTS, 36 I/O | MACROCELL | FLASH PLD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-1FFG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 3.24mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | yes | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 676 | 1.05V | 30 | Other uPs/uCs/Peripheral ICs | 11.8V | 130 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||
XCV600-4FG676CES | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2EG-L1SBVA484I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 484-BFBGA, FCBGA | 484 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B484 | 82 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC4VFX60-10FF1152IS1 | Xilinx |
Min: 1 Mult: 1 |
4 (72 Hours) | 100°C | -40°C | CMOS | Non-RoHS Compliant | BGA | 1.2V | 1152 | no | 3A991.D | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1mm | 30 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 522kB | 10 | 576 | 576 | FIELD PROGRAMMABLE GATE ARRAY | 56880 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-2FBG676I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 2.54mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||
XCR3384XL-12FTG256I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 3 | 85°C | -40°C | CMOS | 1.55mm | RoHS Compliant | 17mm | 17mm | 3.3V | 256 | 256 | yes | 3A991.D | YES | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | INDUSTRIAL | 3.6V | 30 | Programmable Logic Devices | Not Qualified | 212 | EEPROM | 12 | 12 ns | 83MHz | 9000 | 384 | MACROCELL | 24 | EE PLD | YES | YES | |||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2CG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV100-6CSG144C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | CMOS | 1.2mm | RoHS Compliant | 12mm | 12mm | 144 | yes | EAR99 | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 2.5V | 0.8mm | 144 | OTHER | 85°C | 2.625V | 2.375V | 30 | Not Qualified | S-PBGA-B144 | 333MHz | 108904 | FIELD PROGRAMMABLE GATE ARRAY | 600 | 0.6 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA7Z010-1CLG400Q | Xilinx |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, Zynq®-7000 XA | Surface Mount | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | Other uPs/uCs/Peripheral ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||
XC9572XL7VQ64C0962 | Xilinx |
Min: 1 Mult: 1 |
Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z014S-2CLG400E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2016 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 400-LFBGA, CSPBGA | 17mm | 17mm | 400 | 10 Weeks | yes | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | S-PBGA-B400 | 125 | DMA | 256KB | MCU, FPGA | 766MHz | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | 800MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 65K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||
XCV300E-6BGG432C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 1.7mm | RoHS Compliant | BGA | 40mm | 40mm | 1.8V | 432 | yes | 3A991.D | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 432 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 16kB | 6 | 316 | 316 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 82944 | 0.47 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
XA7Z030-1FBV484Q | Xilinx |
Min: 1 Mult: 1 |
download | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C~125°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2010 | /files/xilinxinc-xa7z0201clg484q-datasheets-0818.pdf | 484-BBGA, FCBGA | 484 | 10 Weeks | EAR99 | 8542.39.00.01 | YES | BOTTOM | BALL | S-PBGA-B484 | 130 | DMA | 256KB | MCU, FPGA | 667MHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCV50E-6FGG256C | Xilinx |
Min: 1 Mult: 1 |
3 (168 Hours) | 85°C | 0°C | CMOS | 2mm | RoHS Compliant | FBGA | 17mm | 17mm | 1.8V | 256 | yes | EAR99 | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 256 | OTHER | 1.89V | 30 | Field Programmable Gate Arrays | 8kB | 6 | 176 | 176 | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 1728 | 384 | 0.47 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2CG-L2SFVC784E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC5VLX50T-3FF1136C | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 85°C | 0°C | CMOS | RoHS Compliant | FCBGA | 1V | 1136 | e0 | BOTTOM | BALL | 225 | 1V | 1mm | OTHER | 1.05V | 30 | Field Programmable Gate Arrays | 12.5V | Not Qualified | 480 | 270kB | 3 | 480 | 1412MHz | 46080 | 3600 | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2EG-L2SFVA625E | Xilinx |
Min: 1 Mult: 1 |
download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 625 | 11 Weeks | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.742V | 0.698V | NOT SPECIFIED | R-PBGA-B625 | 180 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC6VHX255T-1FFG1155I | Xilinx |
Min: 1 Mult: 1 |
Surface Mount | 4 (72 Hours) | 100°C | -40°C | CMOS | 3.5mm | RoHS Compliant | FCBGA | 35mm | 35mm | 1155 | yes | 3A991.D | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 1mm | 1155 | INDUSTRIAL | 1.05V | 0.95V | 30 | Field Programmable Gate Arrays | 11.2/2.5V | Not Qualified | S-PBGA-B1155 | 440 | 2.3MB | 440 | 440 | 1098MHz | 253440 | 19800 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns |
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