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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Manufacturer Package Identifier | Reach Compliance Code | HTS Code | Number of Functions | Evaluation Kit | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Max Junction Temperature (Tj) | Ambient Temperature Range High | JESD-30 Code | Memory Size | Number of I/O | Memory Type | RAM Size | Speed Grade | Logic Function | Propagation Delay | Number of Outputs | Number of Timers/Counters | Number of Registers | Number of Inputs | Output Characteristics | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Endurance | Data Retention Time-Min | Access Time (Max) | I/O Type | Memory IC Type | Number of Gates | Operating System | Number of Logic Elements/Cells | Programmable Logic Type | License - User Details | Edition | Media Delivery Type | License Length | Programmable Type | Total RAM Bits | Number of LABs/CLBs | Combinatorial Delay of a CLB-Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EFR-DI-IMG-MA-NOISE-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | RoHS Compliant | 2014 | Site | Electronically Delivered | 1 Year Renewal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-VPSS-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | /files/xilinxinc-efrdivpssww-datasheets-7058.pdf | Site | Electronically Delivered | 1 Year Renewal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-10GEMAC-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-10GEMAC-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-MIPI-PACK-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | ROHS3 Compliant | Site | Electronically Delivered | 1 Year | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR-DI-SMPTE2022-12-WW | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | Worldwide | Electronically Delivered | 1 Year Renewal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-ISE-DSP-FL | Xilinx |
Min: 1 Mult: 1 |
download | Integrated Development Environment (IDE) | ISE® Design Suite | 1 (Unlimited) | RoHS Compliant | 2011 | /files/xilinxinc-docspprousbiignl-datasheets-6563.pdf | Yes | Programming | Windows | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-VIVADO-SYSTEM-NL | Xilinx |
Min: 1 Mult: 1 |
download | Integrated Software Environment (ISE) | Vivado™ Design Suite | Not Applicable | ROHS3 Compliant | 2 Weeks | Programming | Linux, Windows | Fixed Node | System | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-JESD204-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Not Applicable | Non-RoHS Compliant | 2 Weeks | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EF-DI-RSD-SITE | Xilinx |
Min: 1 Mult: 1 |
download | License | LogiCORE™ | Cable | Not Applicable | Non-RoHS Compliant | 2010 | 2 Weeks | No | Decoder | Site | Electronically Delivered | 1 Year | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-CONN-RFSOC | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LMS-FPGA-US | Xilinx |
Min: 1 Mult: 1 |
download | License | Electronically Delivered | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC18V02PC44C0936 | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 3.3V | 44 | 44 | 2 Mb | no | 3A991.B.1 | No | 8542.32.00.61 | 1 | e0 | TIN LEAD | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC18V02 | 44 | 3.6V | 3V | 30 | 256KX8 | 8 | PARALLEL/SERIAL | 20 ns | CONFIGURATION MEMORY | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S30XLPDG8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | Through Hole | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | No SVHC | 8 | Serial | EAR99 | unknown | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S30XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 300kb | PROM | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCF02SVOG20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 50MHz | SYNCHRONOUS | ROHS3 Compliant | 1999 | /files/xilinxinc-xcf16pfsg48c-datasheets-1087.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 1.19mm | 4.39mm | 3.3V | Lead Free | 20 | 10 Weeks | Unknown | 20 | Parallel | yes | EAR99 | XCF02SVOG20C | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 0.65mm | XCF*S | 20 | 3.6V | 3V | 30 | 0.01mA | Not Qualified | 125°C | 85°C | 2Mb | FLASH | 2MX1 | SERIAL | 0.001A | 20 | In System Programmable | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC18V02VQ44C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 44-TQFP | 10mm | 10mm | 3.3V | Contains Lead | 44 | 10 Weeks | 44 | 2 Mb | no | EAR99 | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | GULL WING | 225 | 3.3V | 0.8mm | XC18V02 | 44 | 3.6V | 3V | 30 | Flash Memories | 0.025mA | 20MHz | 256KX8 | 8 | PARALLEL/SERIAL | 0.01A | 20000 Write/Erase Cycles | 20 | 20 ns | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17128ELPD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | SYNCHRONOUS | 4.5974mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | Contains Lead | 8 | 8 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17128EL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 128kb | 3-STATE | 15MHz | 1 | 131072 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17256ELPC20C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2000 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | Contains Lead | 20 | 20 | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | not_compliant | 8542.32.00.61 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17256EL | 20 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S10VO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | EAR99 | not_compliant | 1 | e0 | YES | 4.75V~5.25V | DUAL | GULL WING | 5V | 1.27mm | XC17S10 | 8 | 5.25V | 4.75V | 5V | 0.01mA | Not Qualified | 100kb | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S10PD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 5V | Contains Lead | 8 | 8 | Serial | EAR99 | No | 1 | e0 | NO | 4.75V~5.25V | DUAL | 5V | 2.54mm | XC17S10 | 8 | 5V | 100kb | 1 | 3-STATE | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S10XLPD8I | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | -40°C~85°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | 93.5 kb | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 3.3V | 2.54mm | XC17S10XL | 8 | 3.6V | 3V | 0.005mA | 100kb | 3-STATE | 10MHz | 95752X1 | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S200APD8C | Xilinx |
Min: 1 Mult: 1 |
download | Through Hole | 0°C~70°C | Tube | Not Applicable | CMOS | 4.5974mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | Contains Lead | 8 | 8 | no | EAR99 | No | 1 | e0 | NO | 3V~3.6V | DUAL | 225 | 3.3V | 2.54mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S30VO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | 8 | no | EAR99 | not_compliant | 1 | e0 | YES | 4.75V~5.25V | DUAL | GULL WING | 225 | 5V | 1.27mm | XC17S30 | 8 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 300kb | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S50AVO8C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.93mm | 990μm | 3.94mm | 3.3V | Contains Lead | 8 | 8 | Serial | 1 Mb | no | EAR99 | No | 1 | e0 | 3V~3.6V | DUAL | GULL WING | 225 | 3.3V | 1.27mm | XC17S50A | 8 | 3.6V | 3V | 30 | 0.015mA | 500kb | 3-STATE | 559200X1 | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17V08VQ44C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 44-TQFP | 10mm | 10mm | 3.3V | Contains Lead | 44 | 44 | 8 Mb | no | EAR99 | No | 8542.32.00.61 | 1 | e0 | TIN LEAD | YES | 3V~3.6V | QUAD | GULL WING | 225 | 3.3V | 0.8mm | XC17V08 | 44 | 3.6V | 3V | 30 | 0.1mA | 3-STATE | 20MHz | 1MX8 | 8 | PARALLEL/SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17V16PC44C | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.57mm | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 3.3V | Contains Lead | 44 | 44 | 16 Mb | no | EAR99 | No | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC17V16 | 44 | 3.6V | 3V | 30 | 0.1mA | 3-STATE | 20MHz | 2MX8 | 8 | PARALLEL/SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17V04VQ44I | Xilinx |
Min: 1 Mult: 1 |
download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | Non-RoHS Compliant | 1998 | /files/xilinxinc-xc17v01vo8c-datasheets-2408.pdf | 44-TQFP | 3.3V | Contains Lead | 44 | 4 Mb | no | 3A991.B.1 | No | 8542.32.00.61 | 3V~3.6V | XC17V04 | 44 | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC3SD1800A-4FGG676C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-3A DSP | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | SMD/SMT | CMOS | 667MHz | ROHS3 Compliant | 2008 | /files/xilinxinc-xc3sd1800a4fgg676c-datasheets-4391.pdf | 676-BGA | 27mm | 1.75mm | 27mm | 1.2V | 676 | 10 Weeks | Unknown | 676 | yes | 3A991.D | e1 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | XC3SD1800A | 676 | 30 | Field Programmable Gate Arrays | 1.22.5/3.3V | Not Qualified | 519 | 189kB | 4 | 409 | 1800000 | 37440 | FIELD PROGRAMMABLE GATE ARRAY | 1548288 | 4160 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7K160T-1FBG484C | Xilinx |
Min: 1 Mult: 1 |
download | Kintex®-7 | Surface Mount | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 2.54mm | ROHS3 Compliant | 2008 | /files/xilinxinc-xc7k325t1ffg900i-datasheets-5484.pdf | 484-BBGA, FCBGA | 23mm | 23mm | 484 | 10 Weeks | yes | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7K160 | 484 | Field Programmable Gate Arrays | 11.83.3V | S-PBGA-B484 | 285 | 1.4MB | -1 | 120 ps | 285 | 202800 | 285 | 1098MHz | 162240 | FIELD PROGRAMMABLE GATE ARRAY | 11980800 | 12675 | 0.74 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC6SLX45-3CSG484C | Xilinx |
Min: 1 Mult: 1 |
download | Spartan®-6 LX | Surface Mount | Surface Mount | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.8mm | ROHS3 Compliant | 2008 | /files/xilinxinc-xc6slx452csg484c-datasheets-5636.pdf | 484-FBGA, CSPBGA | 19mm | 19mm | 1.2V | 484 | 10 Weeks | 484 | yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | XC6SLX45 | 484 | 30 | Field Programmable Gate Arrays | Not Qualified | 320 | 261kB | 3 | 310 | 54576 | 862MHz | 43661 | FIELD PROGRAMMABLE GATE ARRAY | 2138112 | 3411 | 0.21 ns |
