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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Number of Receivers | Pbfree Code | ECCN Code | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Logic Function | Function | Power (Watts) | Number of Transmitters | Number of Transceivers | Carrier Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DS2155LNB+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 75mA | ROHS3 Compliant | 2002 | /files/maximintegrated-ds2155gnc2-datasheets-3903.pdf | 100-LQFP | 3.3V | 19 Weeks | 100 | E1, HDLC, J1, T1 | yes | 16.384MHz | unknown | 75mA | 3.14V~3.47V | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | DS2155 | FRAMER | NOT SPECIFIED | Not Qualified | 64 kbps | Transceiver | Single-Chip Transceiver | 1 | |||||||||||||||||||||||||||||||||||
| CYP15G0401RB-BGXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 70°C | 0°C | 640mA | ROHS3 Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0401rbbgi-datasheets-0464.pdf | 256-LBGA Exposed Pad | 3.3V | Lead Free | 3.465V | 3.135V | 256 | LVTTL | No | 690mA | 3.135V~3.465V | CY*15G04 | 4 | 4 | 256-BGA (27x27) | Receiver | ||||||||||||||||||||||||||||||||||||||||
| DS26303LN-120+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 250mA | 1.6mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26303ln75-datasheets-0843.pdf | 144-LQFP Exposed Pad | 20mm | 20mm | 144 | 7 Weeks | LIU | yes | EAR99 | 2.048MHz | 478mA | e3 | Matte Tin (Sn) | 1.65W | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS26303 | PCM TRANSCEIVER | 30 | Digital Transmission Interfaces | 3.3V | 8 | Not Qualified | S-PQFP-G144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||
| PEB 3331 HT V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | Parallel, PCM, Serial | PEB3331 | 1 | P-TQFP-100 | Voice Over IP Processor | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3172N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2 (1 Year) | 328mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 400 | DS3, E3 | yes | EAR99 | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3172 | FRAMER | 30 | Other Telecom ICs | 3.3V | 2 | Not Qualified | S-PBGA-B400 | Single-Chip Transceiver | |||||||||||||||||||||||||||||||||||||||
| PEB 3324 E V1.4-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3324ev14-datasheets-6662.pdf | 176-LBGA | ADPCM | PEB3324 | 4 | PG-LBGA-176 | Analog Voice Access | 400mW | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS32512+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 1 (Unlimited) | 150mA | ROHS3 Compliant | 2008 | /files/maximintegrated-ds32512n-datasheets-0409.pdf | 484-BGA | 23mm | 23mm | 484 | LIU | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 1.8V | DS32512 | PCM TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 1 | Not Qualified | S-PBGA-B484 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||
| DS3150TNC1+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2 (1 Year) | ROHS3 Compliant | 2005 | /files/maximintegrated-ds3150qnc1tr-datasheets-3911.pdf | 48-LQFP | 6 Weeks | LIU | 3.135V~3.465V | DS3150 | 1 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3253N# | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 220mA | 1.76mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3252-datasheets-6411.pdf | 144-BGA, CSPBGA | 144 | LIU | no | YES | 3.135V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | DS3253 | PCM TRANSCEIVER | NOT SPECIFIED | 3 | S-PBGA-B144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||
| DS3153N# | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 225mA | 1.76mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds3152-datasheets-6462.pdf | 144-BGA, CSPBGA | 144 | LIU | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS3153 | PCM TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 3 | Not Qualified | S-PBGA-B144 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||
| DS26324GN+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 2 (1 Year) | 85°C | -40°C | 500mA | ROHS3 Compliant | 2011 | /files/maximintegrated-ds26324gna3-datasheets-4479.pdf | 256-LBGA, CSBGA | 256 | LIU | 3.135V~3.465V | DS26324 | 16 | 256-CSBGA (17x17) | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||
| PEB 3320 HT V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | ADPCM | PEB3320 | 1 | P-TQFP-100 | Voice Over IP Processor | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2155LC2+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 2A (4 Weeks) | 75mA | ROHS3 Compliant | 2002 | /files/maximintegrated-ds2155gnc2-datasheets-3903.pdf | 100-LQFP | 3.3V | 75mA | 6 Weeks | 100 | E1, HDLC, J1, T1 | yes | e3 | Matte Tin (Sn) | 3.14V~3.47V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS2155 | FRAMER | NOT SPECIFIED | Other Telecom ICs | Not Qualified | Transceiver | Single-Chip Transceiver | 1 | |||||||||||||||||||||||||||||||||||
| PEF 21628 E V1.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SOCRATES™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 324-LBGA | HDLC, Parallel, Serial | 1.5V 3.3V | PEF21628 | 1 | PG-LBGA-324-2 | EFM-(Ethernet First Mile) Symmetrical DSL Transceiver | 650mW | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYP15G0403DXB-BGXI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 900mA | Non-RoHS Compliant | 2003 | /files/cypresssemiconductorcorp-cyv15g0403dxbbgc-datasheets-0456.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | not_compliant | 1.32A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | CY*15G04 | 20 | Network Interfaces | 4 | Not Qualified | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| DS26524GA5+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 260mA | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26524g-datasheets-0346.pdf | 256-LBGA, CSBGA | LIU | yes | 3.135V~3.465V | NOT SPECIFIED | DS26524 | TIME SLOT 0/16 TRANSCEIVER | NOT SPECIFIED | 4 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||
| DS3150QC1+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | ROHS3 Compliant | 2005 | /files/maximintegrated-ds3150qnc1tr-datasheets-3911.pdf | 28-LCC (J-Lead) | 110mA | 28 | LIU | 3.135V~3.465V | DS3150 | 1 | 51.84 Mbps | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PEF 22624 E V2.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SOCRATES™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | /files/infineontechnologies-pef21624ev12g-datasheets-6774.pdf | 324-LBGA | HDLC, Serial, TDM | compliant | PEF22624 | 2 | Symmetrical DSL Front End (SDFE) | 500mW | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS26401N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 275mA | ROHS3 Compliant | 2003 | /files/maximintegrated-ds26401a2-datasheets-0298.pdf | 256-LBGA, CSBGA | WAN | yes | 3.135V~3.465V | NOT SPECIFIED | DS26401 | FRAMER | NOT SPECIFIED | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3174+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 725mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 27mm | 27mm | 400 | DS3, E3 | yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | DS3174 | FRAMER | NOT SPECIFIED | Other Telecom ICs | 3.3V | 4 | Not Qualified | Single-Chip Transceiver | ||||||||||||||||||||||||||||||||||||
| DS26524GN+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BIPOLAR | 260mA | 1.76mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26524g-datasheets-0346.pdf | 256-LBGA, CSBGA | 17mm | 17mm | 3.3V | 450mA | 256 | 256 | LIU | yes | EAR99 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS26524 | TIME SLOT 0/16 TRANSCEIVER | Other Telecom ICs | 4 | 2.048 Mbps | Line Interface Unit (LIU) | T-1(DS1) | ||||||||||||||||||||||||||||||
| DS3172+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 328mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 400 | DS3, E3 | yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3172 | FRAMER | NOT SPECIFIED | Other Telecom ICs | 3.3V | 2 | Not Qualified | S-PBGA-B400 | Single-Chip Transceiver | ||||||||||||||||||||||||||||||||||||||
| DS26303LN-75+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 250mA | 1.6mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26303ln75-datasheets-0843.pdf | 144-LQFP Exposed Pad | 20mm | 20mm | 3.465V | 144 | 7 Weeks | LIU | yes | EAR99 | Tin | 2.048MHz | 478mA | e3 | 1.65W | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS26303 | PCM TRANSCEIVER | NOT SPECIFIED | 8 | Not Qualified | S-PQFP-G144 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||
| DS3252N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 150mA | 1.76mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3252-datasheets-6411.pdf | 144-BGA, CSPBGA | 13mm | 13mm | 200mA | 144 | LIU | yes | EAR99 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.3V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS3252 | PCM TRANSCEIVER | 30 | 51.84 Mbps | Line Interface Unit (LIU) | 2 | ||||||||||||||||||||||||||||||||||
| DS2155LNC2+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 85°C | -40°C | 75mA | 75mA | ROHS3 Compliant | 2002 | /files/maximintegrated-ds2155gnc2-datasheets-3903.pdf | 100-LQFP | 6 Weeks | 3.465V | 3.135V | 100 | E1, HDLC, J1, T1 | 1 | No | 3.14V~3.47V | DS2155 | 1 | 100-LQFP (14x14) | 2.048 Mbps | Transceiver | Single-Chip Transceiver | 1 | |||||||||||||||||||||||||||||||||||||||
| DS3112+W | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 150mA | 2.34mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3120n-datasheets-5509.pdf | 256-BGA | 27mm | 27mm | 3.3V | 150mA | 256 | 256 | Parallel/Serial | yes | No | 1 | e3 | Matte Tin (Sn) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3112 | 256 | FRAMER | 44.736 Mbps | 1 | |||||||||||||||||||||||||||||||||
| CYV15G0402DXB-BGXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 830mA | ROHS3 Compliant | 2003 | /files/cypresssemiconductorcorp-cyp15g0402dxbbgxc-datasheets-0570.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | Lead Free | 256 | 256 | LVTTL | not_compliant | 1 | 1.06A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | CY*15G04 | 256 | TELECOM CIRCUIT | 20 | Network Interfaces | 3.3V | 4 | Not Qualified | 1.5 Gbps | 4 | ||||||||||||||||||||||||||||
| 82V2108BBG | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 160mA | /files/renesaselectronicsamericainc-82v2108px8-datasheets-0745.pdf | 144-BGA | Parallel | 2.97V~3.63V | IDT82V2108 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3112D1+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | CMOS | 150mA | 2.34mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3120n-datasheets-5509.pdf | 256-BGA | 27mm | 27mm | 3.3V | 150mA | 256 | 256 | Parallel/Serial | no | EAR99 | No | 1 | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | DS3112 | 256 | FRAMER | 20 | 44.736 Mbps | 1 | |||||||||||||||||||||||||||||||||
| 82V2054DA | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 15mA | Non-RoHS Compliant | /files/renesaselectronicsamericainc-82v2054bb-datasheets-0684.pdf | 144-LQFP | Logic | 3.13V~3.47V | IDT82V2054 | Line Interface Unit (LIU) |
