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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Number of Receivers | Pbfree Code | ECCN Code | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Logic Function | Function | Power (Watts) | Number of Transmitters | Number of Transceivers | Carrier Type |
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| PEB 3342 HT V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | Parallel, PCM, Serial | PEB3342 | 2 | P-TQFP-100 | Voice Over IP Processor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CS61584A-IQ3Z | Cirrus Logic Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 1.6mm | RoHS Compliant | 2001 | /files/cirruslogicinc-cs61584aiq3z-datasheets-0938.pdf | 64-LQFP | 10mm | 10mm | 5V | 64 | 64 | E1, T1 | yes | No | e3 | MATTE TIN | 5V | 350mW | 3.135V~5.25V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | CS61584A | PCM TRANSCEIVER | 40 | Digital Transmission Interfaces | 3.3V | 2 | 2.048 Mbps | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||
| CYP15G0401DXB-BGXI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 830mA | ROHS3 Compliant | 2003 | 256-LBGA Exposed Pad | 27mm | 970μm | 27mm | 3.3V | Lead Free | 1.1A | 256 | 14 Weeks | 256 | LVTTL | yes | 5A991.B.1 | No | 1.1A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | CY*15G04 | 30 | Network Interfaces | 4 | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| DS32508N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | 2.41mm | ROHS3 Compliant | 2008 | /files/maximintegrated-ds32512n-datasheets-0409.pdf | 484-BGA | 23mm | 23mm | 484 | 484 | LIU | yes | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | 1.8V 3.3V | BOTTOM | BALL | 260 | 1.8V | 1mm | DS32508 | PCM TRANSCEIVER | Digital Transmission Interfaces | 1.83.3V | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||
| DS3151+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 75mA | ROHS3 Compliant | 2007 | /files/maximintegrated-ds3152-datasheets-6462.pdf | 144-BGA, CSPBGA | 144 | LIU | yes | EAR99 | YES | 3.135V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | DS3151 | PCM TRANSCEIVER | NOT SPECIFIED | 1 | Not Qualified | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||
| 82V2084PF8 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | Non-RoHS Compliant | /files/renesaselectronicsamericainc-82v2084pf-datasheets-0765.pdf | 128-LQFP | LIU | 3.13V~3.47V | IDT82V2084 | 128-TQFP (14x20) | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2155LNB+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 75mA | ROHS3 Compliant | 2002 | /files/maximintegrated-ds2155gnc2-datasheets-3903.pdf | 100-LQFP | 3.3V | 19 Weeks | 100 | E1, HDLC, J1, T1 | yes | 16.384MHz | unknown | 75mA | 3.14V~3.47V | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | DS2155 | FRAMER | NOT SPECIFIED | Not Qualified | 64 kbps | Transceiver | Single-Chip Transceiver | 1 | ||||||||||||||||||||||||||||||||||||||
| CYP15G0401RB-BGXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 70°C | 0°C | 640mA | ROHS3 Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0401rbbgi-datasheets-0464.pdf | 256-LBGA Exposed Pad | 3.3V | Lead Free | 3.465V | 3.135V | 256 | LVTTL | No | 690mA | 3.135V~3.465V | CY*15G04 | 4 | 4 | 256-BGA (27x27) | Receiver | |||||||||||||||||||||||||||||||||||||||||||
| DS26303LN-120+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 250mA | 1.6mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26303ln75-datasheets-0843.pdf | 144-LQFP Exposed Pad | 20mm | 20mm | 144 | 7 Weeks | LIU | yes | EAR99 | 2.048MHz | 478mA | e3 | Matte Tin (Sn) | 1.65W | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS26303 | PCM TRANSCEIVER | 30 | Digital Transmission Interfaces | 3.3V | 8 | Not Qualified | S-PQFP-G144 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||
| PEB 3331 HT V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | Parallel, PCM, Serial | PEB3331 | 1 | P-TQFP-100 | Voice Over IP Processor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3172N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2 (1 Year) | 328mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 400 | DS3, E3 | yes | EAR99 | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3172 | FRAMER | 30 | Other Telecom ICs | 3.3V | 2 | Not Qualified | S-PBGA-B400 | Single-Chip Transceiver | ||||||||||||||||||||||||||||||||||||||||||
| PEB 3324 E V1.4-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3324ev14-datasheets-6662.pdf | 176-LBGA | ADPCM | PEB3324 | 4 | PG-LBGA-176 | Analog Voice Access | 400mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS32512+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 1 (Unlimited) | 150mA | ROHS3 Compliant | 2008 | /files/maximintegrated-ds32512n-datasheets-0409.pdf | 484-BGA | 23mm | 23mm | 484 | LIU | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 1.8V | DS32512 | PCM TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 1 | Not Qualified | S-PBGA-B484 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||
| DS3150TNC1+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2 (1 Year) | ROHS3 Compliant | 2005 | /files/maximintegrated-ds3150qnc1tr-datasheets-3911.pdf | 48-LQFP | 6 Weeks | LIU | 3.135V~3.465V | DS3150 | 1 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3253N# | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 220mA | 1.76mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3252-datasheets-6411.pdf | 144-BGA, CSPBGA | 144 | LIU | no | YES | 3.135V~3.465V | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | DS3253 | PCM TRANSCEIVER | NOT SPECIFIED | 3 | S-PBGA-B144 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||
| DS3153N# | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 225mA | 1.76mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds3152-datasheets-6462.pdf | 144-BGA, CSPBGA | 144 | LIU | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS3153 | PCM TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 3 | Not Qualified | S-PBGA-B144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||
| DS26324GN+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 2 (1 Year) | 85°C | -40°C | 500mA | ROHS3 Compliant | 2011 | /files/maximintegrated-ds26324gna3-datasheets-4479.pdf | 256-LBGA, CSBGA | 256 | LIU | 3.135V~3.465V | DS26324 | 16 | 256-CSBGA (17x17) | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| PEB 3320 HT V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | ADPCM | PEB3320 | 1 | P-TQFP-100 | Voice Over IP Processor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 82V2088DR | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/renesaselectronicsamericainc-82v2088dr-datasheets-0818.pdf | 208-BFQFP | LIU | 3.13V~3.47V | IDT82V2088 | 208-PQFP (28x28) | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 82V2048SDAG | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 55mA | /files/renesaselectronicsamericainc-82v2048sda-datasheets-0645.pdf | 144-LQFP | LIU | 3.13V~3.47V | IDT82V2048 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYP15G0403DXB-BGC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 70°C | 0°C | 900mA | Non-RoHS Compliant | 2003 | /files/cypresssemiconductorcorp-cyv15g0403dxbbgc-datasheets-0456.pdf | 256-LBGA Exposed Pad | 3.3V | 3.465V | 3.135V | 256 | LVTTL | 1.27A | 3.135V~3.465V | CY*15G04 | 4 | 4 | 256-BGA (27x27) | Transceiver | |||||||||||||||||||||||||||||||||||||||||||||
| DS26401N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 275mA | ROHS3 Compliant | 2003 | /files/maximintegrated-ds26401a2-datasheets-0298.pdf | 256-LBGA, CSBGA | WAN | yes | 3.135V~3.465V | NOT SPECIFIED | DS26401 | FRAMER | NOT SPECIFIED | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3174+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 725mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 27mm | 27mm | 400 | DS3, E3 | yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | DS3174 | FRAMER | NOT SPECIFIED | Other Telecom ICs | 3.3V | 4 | Not Qualified | Single-Chip Transceiver | |||||||||||||||||||||||||||||||||||||||
| DS26524GN+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BIPOLAR | 260mA | 1.76mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26524g-datasheets-0346.pdf | 256-LBGA, CSBGA | 17mm | 17mm | 3.3V | 450mA | 256 | 256 | LIU | yes | EAR99 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS26524 | TIME SLOT 0/16 TRANSCEIVER | Other Telecom ICs | 4 | 2.048 Mbps | Line Interface Unit (LIU) | T-1(DS1) | |||||||||||||||||||||||||||||||||
| DS3172+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 328mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 400 | DS3, E3 | yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3172 | FRAMER | NOT SPECIFIED | Other Telecom ICs | 3.3V | 2 | Not Qualified | S-PBGA-B400 | Single-Chip Transceiver | |||||||||||||||||||||||||||||||||||||||||
| DS26303LN-75+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 250mA | 1.6mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26303ln75-datasheets-0843.pdf | 144-LQFP Exposed Pad | 20mm | 20mm | 3.465V | 144 | 7 Weeks | LIU | yes | EAR99 | Tin | 2.048MHz | 478mA | e3 | 1.65W | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS26303 | PCM TRANSCEIVER | NOT SPECIFIED | 8 | Not Qualified | S-PQFP-G144 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||
| DS3252N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 150mA | 1.76mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3252-datasheets-6411.pdf | 144-BGA, CSPBGA | 13mm | 13mm | 200mA | 144 | LIU | yes | EAR99 | No | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.3V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS3252 | PCM TRANSCEIVER | 30 | 51.84 Mbps | Line Interface Unit (LIU) | 2 | |||||||||||||||||||||||||||||||||||||
| DS2155LNC2+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 85°C | -40°C | 75mA | 75mA | ROHS3 Compliant | 2002 | /files/maximintegrated-ds2155gnc2-datasheets-3903.pdf | 100-LQFP | 6 Weeks | 3.465V | 3.135V | 100 | E1, HDLC, J1, T1 | 1 | No | 3.14V~3.47V | DS2155 | 1 | 100-LQFP (14x14) | 2.048 Mbps | Transceiver | Single-Chip Transceiver | 1 | ||||||||||||||||||||||||||||||||||||||||||
| DS3112+W | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 150mA | 2.34mm | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3120n-datasheets-5509.pdf | 256-BGA | 27mm | 27mm | 3.3V | 150mA | 256 | 256 | Parallel/Serial | yes | No | 1 | e3 | Matte Tin (Sn) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3112 | 256 | FRAMER | 44.736 Mbps | 1 | ||||||||||||||||||||||||||||||||||||
| CYV15G0402DXB-BGXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 830mA | ROHS3 Compliant | 2003 | /files/cypresssemiconductorcorp-cyp15g0402dxbbgxc-datasheets-0570.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | Lead Free | 256 | 256 | LVTTL | not_compliant | 1 | 1.06A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | CY*15G04 | 256 | TELECOM CIRCUIT | 20 | Network Interfaces | 3.3V | 4 | Not Qualified | 1.5 Gbps | 4 |
