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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Resistance | Number of Pins | Interface | Pbfree Code | ECCN Code | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Logic Function | Function | Power (Watts) | Number of Transmitters |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PEB 3332 HT V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | ADPCM, Parallel, Serial | PEB3332 | 2 | P-TQFP-100 | Voice Over IP Processor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21Q554BN+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 1998 | /files/maximintegrated-ds21q354-datasheets-5511.pdf | 256-BGA | 10 Weeks | 256 | E1 | No | 5V | DS21Q554 | 4 | Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEB 33321 EL V2.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 144-LBGA | Parallel, PCM, Serial | PEB33321 | 1 | PG-LBGA-144 | Voice Over IP Processor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEF 3314 E V2.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 176-LBGA | JTAG, PCM, SCI/SPI | PEF3314 | 4 | PG-LBGA-176 | Analog Voice Access | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HC55121IMZ | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | UniSLIC14 | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 2.25mA | ROHS3 Compliant | /files/renesaselectronicsamericainc-hc55143im-datasheets-6131.pdf | 28-LCC (J-Lead) | e3 | Matte Tin (Sn) | 4.75V~5.25V | NOT SPECIFIED | HC55121 | NOT SPECIFIED | 1 | Subscriber Line Interface Concept (SLIC) | 1.5W | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PSB 21653 EL V1.5-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | INCA™ | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | /files/infineontechnologies-psb21653elv15g-datasheets-1102.pdf | 324-LBGA | PCM, SPI | PSB21653 | 1 | PG-LBGA-324-3 | Single-Chip IP-Phone Solution | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEB 3341 F V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | Parallel, PCM, Serial | PEB3341 | 1 | P-TQFP-100 | Voice Over IP Processor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3154+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 300mA | 1.76mm | ROHS3 Compliant | 2005 | /files/maximintegrated-ds3152-datasheets-6462.pdf | 144-BGA, CSPBGA | 13mm | 13mm | 144 | 11 Weeks | LIU | no | not_compliant | e0 | Tin/Lead (Sn/Pb) | YES | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1mm | DS3154 | PCM TRANSCEIVER | 20 | Digital Transmission Interfaces | 3.3V | 4 | Not Qualified | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||
| HC55140IMZ | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | UniSLIC14 | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 2.25mA | ROHS3 Compliant | /files/renesaselectronicsamericainc-hc55143im-datasheets-6131.pdf | 28-LCC (J-Lead) | e3 | Matte Tin (Sn) | 4.75V~5.25V | NOT SPECIFIED | HC55140 | NOT SPECIFIED | 1 | Subscriber Line Interface Concept (SLIC) | 1.5W | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MAX2990ECB+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | 490kHz | 80mA | ROHS3 Compliant | 2005 | /files/maximintegrated-max2990ecb-datasheets-1113.pdf | 64-LQFP | 10.2mm | 1.45mm | 10.2mm | 1.8V | 342.689036mg | 1.98V | 1.7V | 10kOhm | 64 | I2C, SPI, UART | yes | Tin | No | MAX2990 | 1 | 100 kbps | Power Line Communication Modem (PLC) | ||||||||||||||||||||||||||||||||||||||||
| PEF 20512 E V1.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 323-BBGA, FCBGA | E1, HDLC, PPP, Serial, T1, TMA | PEF20512 | 323-FCLBGA | Multichannel Network Interface Controller (MUNICH) | 2W | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS26334GA3+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 2 (1 Year) | 500mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds26334gna2-datasheets-4087.pdf | 256-LBGA, CSBGA | LIU | 3.135V~3.465V | DS26334 | 16 | 256-CSBGA (17x17) | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEB 33322 EL V2.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 144-LBGA | Parallel, PCM, Serial | PEB33322 | 2 | PG-LBGA-144 | Analog Voice Access | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEF 20256 E V3.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 200mA | /files/infineontechnologies-pef20256ev32g-datasheets-1012.pdf | 323-BBGA, FCBGA | HDLC, PPP, SS7, TMA | 3V~3.6V | PEF20256 | 323-FCLBGA | Multichannel Network Interface Controller (MUNICH) | 3W | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| STLC60845 | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | CMOS | ROHS3 Compliant | 292 | 256 | 8542.39.00.01 | 1 | YES | BOTTOM | BALL | 1.8V | STLC60 | 292 | TELECOM CIRCUIT | Not Qualified | S-PBGA-B292 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEF 24624 E V2.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SOCRATES™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | /files/infineontechnologies-pef21624ev12g-datasheets-6774.pdf | 324-LBGA | 324 | DSL, SHDSL, TDM | compliant | YES | BOTTOM | BALL | 1.8V | PEF24624 | TELECOM CIRCUIT | 4 | Symmetrical DSL Front End (SDFE) | 500mW | |||||||||||||||||||||||||||||||||||||||||||||||||
| PSB 6972 HL V1.3 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | XWAY™TANTOS | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-psb6972hlv13-datasheets-1064.pdf | 100-LQFP | TX / FX | 3.3V | PSB6972 | 1 | Ethernet Switch Controller | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEF 21624 E V2.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SOCRATES™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | /files/infineontechnologies-pef21624ev12g-datasheets-6774.pdf | 324-LBGA | HDLC, Serial, TDM | compliant | PEF21624 | 1 | Symmetrical DSL Front End (SDFE) | 500mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEF 24628 E V1.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SOCRATES™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 324-LBGA | HDLC, Parallel, Serial | 1.5V 3.3V | PEF24628 | 1 | PG-LBGA-324-2 | EFM-(Ethernet First Mile) Symmetrical DSL Transceiver | 650mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYV15G0404RB-BGC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 5 (48 Hours) | BICMOS | 900mA | Non-RoHS Compliant | 2007 | /files/cypresssemiconductorcorp-cyv15g0404rbbgxc-datasheets-6745.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | 256 | LVTTL | No | 1.27A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | TELECOM CIRCUIT | 30 | 4 | 1.5 Gbps | Deserializer | |||||||||||||||||||||||||||||||||||
| 82V2088DRG | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | /files/renesaselectronicsamericainc-82v2088dr-datasheets-0818.pdf | 208-BFQFP | LIU | 3.13V~3.47V | IDT82V2088 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEF 22628 E V1.2-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SOCRATES™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 324-LBGA | HDLC, Parallel, Serial | 1.5V 3.3V | PEF22628 | 2 | PG-LBGA-324-2 | EFM-(Ethernet First Mile) Symmetrical DSL Transceiver | 650mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21448G+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | 320mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds21448l-datasheets-3172.pdf | 144-BGA | 19 Weeks | 3.135V~3.465V | DS21448 | PCM TRANSCEIVER | 4 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2155LNB+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 2A (4 Weeks) | 75mA | ROHS3 Compliant | 2002 | /files/maximintegrated-ds2155gnc2-datasheets-3903.pdf | 100-LQFP | 3.3V | 19 Weeks | 100 | E1, HDLC, J1, T1 | yes | 16.384MHz | unknown | 75mA | 3.14V~3.47V | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | DS2155 | FRAMER | NOT SPECIFIED | Not Qualified | 64 kbps | Transceiver | Single-Chip Transceiver | 1 | ||||||||||||||||||||||||||||||||||||
| CYP15G0401RB-BGXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 70°C | 0°C | 640mA | ROHS3 Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0401rbbgi-datasheets-0464.pdf | 256-LBGA Exposed Pad | 3.3V | Lead Free | 3.465V | 3.135V | 256 | LVTTL | No | 690mA | 3.135V~3.465V | CY*15G04 | 4 | 4 | 256-BGA (27x27) | Receiver | |||||||||||||||||||||||||||||||||||||||||
| DS26303LN-120+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 250mA | 1.6mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26303ln75-datasheets-0843.pdf | 144-LQFP Exposed Pad | 20mm | 20mm | 144 | 7 Weeks | LIU | yes | EAR99 | 2.048MHz | 478mA | e3 | Matte Tin (Sn) | 1.65W | 3.135V~3.465V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | DS26303 | PCM TRANSCEIVER | 30 | Digital Transmission Interfaces | 3.3V | 8 | Not Qualified | S-PQFP-G144 | Line Interface Unit (LIU) | ||||||||||||||||||||||||||||||
| PEB 3331 HT V2.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3331htv21-datasheets-6646.pdf | 100-LQFP | Parallel, PCM, Serial | PEB3331 | 1 | P-TQFP-100 | Voice Over IP Processor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3172N+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 2 (1 Year) | 328mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 400 | DS3, E3 | yes | EAR99 | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3172 | FRAMER | 30 | Other Telecom ICs | 3.3V | 2 | Not Qualified | S-PBGA-B400 | Single-Chip Transceiver | ||||||||||||||||||||||||||||||||||||||||
| PEB 3324 E V1.4-G | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | /files/infineontechnologies-peb3324ev14-datasheets-6662.pdf | 176-LBGA | ADPCM | PEB3324 | 4 | PG-LBGA-176 | Analog Voice Access | 400mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS32512+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 1 (Unlimited) | 150mA | ROHS3 Compliant | 2008 | /files/maximintegrated-ds32512n-datasheets-0409.pdf | 484-BGA | 23mm | 23mm | 484 | LIU | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 1.8V | DS32512 | PCM TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 1 | Not Qualified | S-PBGA-B484 | Line Interface Unit (LIU) |
