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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Number of Receivers | Pbfree Code | ECCN Code | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Telecom IC Type | Number of Channels | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Logic Function | Function | Power (Watts) | Number of Transmitters | Number of Transceivers | Carrier Type |
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| CYV15G0401DXB-BGC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 5 (48 Hours) | BICMOS | 870mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0401dxbbgi-datasheets-0460.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | not_compliant | 1.06A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | 30 | Network Interfaces | 4 | Not Qualified | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| CYW15G0101DXB-BBC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 390mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0101dxbbbxi-datasheets-6522.pdf | 100-LBGA | 100 | 100 | LVTTL | not_compliant | 500mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | CY*15G01 | 1 | NOT SPECIFIED | Network Interfaces | 3.3V | Not Qualified | Transceiver | 1 | |||||||||||||||||||||||||||||||||||
| CYW15G0401DXB-BGC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 830mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0401dxbbgi-datasheets-0460.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | 256 | LVTTL | not_compliant | 1.06A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | 30 | Network Interfaces | 3.3V | 4 | Not Qualified | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| CYW15G0101DXB-BBI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 390mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0101dxbbbxi-datasheets-6522.pdf | 100-LBGA | 100 | 100 | LVTTL | No | 510mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | CY*15G01 | 1 | Network Interfaces | 3.3V | Transceiver | 1 | |||||||||||||||||||||||||||||||||||||
| CYP15G0402DXB-BGC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 830mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0402dxbbgc-datasheets-0442.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | unknown | 1 | 1.06A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | 256 | TELECOM CIRCUIT | 30 | Network Interfaces | 4 | Not Qualified | 1.5 Gbps | 4 | |||||||||||||||||||||||||||||
| PEF 3314 E V2.1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | VINETIC® | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | Non-RoHS Compliant | /files/infineontechnologies-peb3324ev14-datasheets-6662.pdf | 176-LBGA | ADPCM | PEF3314 | 4 | PG-LBGA-176 | Analog Voice Access | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYP15G0401TB-BGI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 590mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0401tbbgc-datasheets-0423.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | LVTTL | not_compliant | 820mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | TELECOM CIRCUIT | 30 | 4 | Not Qualified | S-PBGA-B256 | Driver | ||||||||||||||||||||||||||||||||||
| CYV15G0101DXB-BBI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 390mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0101dxbbbxi-datasheets-6522.pdf | 100-LBGA | 3.3V | Contains Lead | 100 | 100 | LVTTL | not_compliant | 510mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | CY*15G01 | INTERFACE CIRCUIT | 1 | NOT SPECIFIED | Network Interfaces | Not Qualified | Transceiver | 1 | |||||||||||||||||||||||||||||||||
| CYV15G0403DXB-BGC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 5 (48 Hours) | BICMOS | 900mA | Non-RoHS Compliant | 2003 | /files/cypresssemiconductorcorp-cyv15g0403dxbbgc-datasheets-0456.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | not_compliant | 1.27A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | 30 | Network Interfaces | 4 | Not Qualified | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| CYW15G0201DXB-BBC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 570mA | 1.5mm | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0201dxbbbxi-datasheets-6576.pdf | 196-LBGA | 15mm | 15mm | 196 | 196 | LVTTL | not_compliant | 700mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1mm | CY*15G02 | TELECOM CIRCUIT | 30 | Network Interfaces | 3.3V | 2 | Not Qualified | 1500000 Mbps | Transceiver | 2 | |||||||||||||||||||||||||||||
| CYV15G0401DXB-BGI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 5 (48 Hours) | BICMOS | 830mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0401dxbbgi-datasheets-0460.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | not_compliant | 1.1A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | 30 | Network Interfaces | 4 | Not Qualified | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| CYP15G0403DXB-BGI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 900mA | Non-RoHS Compliant | 2003 | /files/cypresssemiconductorcorp-cyv15g0403dxbbgc-datasheets-0456.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | not_compliant | 1.32A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | 30 | Network Interfaces | 4 | Not Qualified | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| CYP15G0401RB-BGI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 640mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0401rbbgi-datasheets-0464.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 256 | 256 | LVTTL | not_compliant | 740mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | TELECOM CIRCUIT | 30 | 4 | Not Qualified | Receiver | ||||||||||||||||||||||||||||||||||
| E-LS1240A | STMicroelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | -40°C~70°C | Tube | 1 (Unlimited) | 1.22kHz | 30mA | ROHS3 Compliant | /files/stmicroelectronics-ls1240ad1-datasheets-0312.pdf | 8-DIP (0.300, 7.62mm) | 7.62mm | 8 | 8 | 26V | DUAL | 250 | 26V | 2.54mm | LS1240 | TELEPHONE RINGER CIRCUIT | 40 | Telephone Circuits | 26V | 1 | Not Qualified | Tone Ringer | |||||||||||||||||||||||||||||||||||||||||
| CYV15G0403DXB-BGXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 900mA | ROHS3 Compliant | 2003 | /files/cypresssemiconductorcorp-cyv15g0403dxbbgc-datasheets-0456.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | No | 1.27A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | CY*15G04 | TELECOM CIRCUIT | 20 | Network Interfaces | 4 | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| CYV15G0101DXB-BBC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 390mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0101dxbbbxi-datasheets-6522.pdf | 100-LBGA | 3.3V | 100 | 100 | LVTTL | not_compliant | 500mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | CY*15G01 | TELECOM CIRCUIT | 1 | NOT SPECIFIED | Network Interfaces | Not Qualified | Transceiver | 1 | ||||||||||||||||||||||||||||||||||
| PEF 24625 E V1.2 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SOCRATES™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | Non-RoHS Compliant | /files/infineontechnologies-pef24624ev12g-datasheets-9992.pdf | 484-BBGA | DSL, SHDSL, TDM | PEF24625 | 1 | 484-BGA (27x27) | Symmetrical DSL Controller (SDC-16i) | 500mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| CYP15G0403DXB-BGXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 900mA | ROHS3 Compliant | 2003 | /files/cypresssemiconductorcorp-cyv15g0403dxbbgc-datasheets-0456.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | Lead Free | 256 | 15 Weeks | 256 | LVTTL | yes | 5A991.B.1 | No | 1.27A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | CY*15G04 | 30 | Network Interfaces | 4 | 1500000 Mbps | Transceiver | 4 | ||||||||||||||||||||||||||||
| UCC3751DG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -55°C~125°C | Tube | 1 (Unlimited) | BICMOS | 50Hz | 1mA | ROHS3 Compliant | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | 12V | Contains Lead | 16 | 141.690917mg | 16 | no | DUAL | GULL WING | NOT SPECIFIED | 12V | UCC3751 | TELECOM CIRCUIT | NOT SPECIFIED | Telephone Circuits | 1 | Not Qualified | Ring Generator Controller | ||||||||||||||||||||||||||||||||||||||
| DS26324GNA2+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | 500mA | 1.76mm | ROHS3 Compliant | 2011 | /files/maximintegrated-ds26324gna3-datasheets-4479.pdf | 256-LBGA, CSBGA | 17mm | 17mm | 256 | LIU | yes | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS26324 | PCM TRANSCEIVER | NOT SPECIFIED | 16 | Not Qualified | S-PBGA-B256 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||
| CYV15G0403DXB-BGI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 900mA | Non-RoHS Compliant | 2003 | /files/cypresssemiconductorcorp-cyv15g0403dxbbgc-datasheets-0456.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | not_compliant | 1.32A | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | 30 | Network Interfaces | 4 | Not Qualified | 1500000 Mbps | Transceiver | 4 | |||||||||||||||||||||||||||||||
| DS2155G+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | 75mA | 75mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds2155gnc2-datasheets-3903.pdf | 100-LFBGA, CSPBGA | 3.3V | 75mA | 5 Weeks | 3.465V | 3.135V | 100 | E1, HDLC, J1, T1 | 1 | No | 3.14V~3.47V | DS2155 | 1 | 100-CSBGA (10x10) | 64 kbps | Transceiver | Single-Chip Transceiver | 1 | 1 | ||||||||||||||||||||||||||||||||||||
| CYP15G0201DXB-BBC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 570mA | 1.5mm | Non-RoHS Compliant | 2003 | /files/cypresssemiconductorcorp-cyp15g0201dxbbbi-datasheets-0336.pdf | 196-LBGA | 15mm | 15mm | 3.3V | 196 | 196 | LVTTL | not_compliant | 700mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 220 | 3.3V | 1mm | CY*15G02 | NOT SPECIFIED | Network Interfaces | 2 | Not Qualified | 1500000 Mbps | Transceiver | 2 | ||||||||||||||||||||||||||||||
| DS26524G+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BIPOLAR | 260mA | 1.76mm | ROHS3 Compliant | 2007 | /files/maximintegrated-ds26524g-datasheets-0346.pdf | 256-LBGA, CSBGA | 17mm | 17mm | 256 | LIU | yes | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | DS26524 | TIME SLOT 0/16 TRANSCEIVER | NOT SPECIFIED | Other Telecom ICs | 3.3V | 4 | Not Qualified | S-PBGA-B256 | Line Interface Unit (LIU) | T-1(DS1) | |||||||||||||||||||||||||||||||
| CYP15G0401TB-BGC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 590mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyp15g0401tbbgc-datasheets-0423.pdf | 256-LBGA Exposed Pad | 27mm | 27mm | 3.3V | 256 | 256 | LVTTL | No | 770mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | CY*15G04 | TELECOM CIRCUIT | 30 | 4 | Driver | ||||||||||||||||||||||||||||||||||
| DS3174 | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C | Tray | 5 (48 Hours) | 725mA | ROHS3 Compliant | 2006 | /files/maximintegrated-ds3174n-datasheets-0287.pdf | 349-BBGA, CSBGA Exposed Pad | 27mm | 27mm | 400 | 400 | DS3, E3 | no | EAR99 | No | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1.27mm | DS3174 | FRAMER | Other Telecom ICs | 3.3V | 4 | Transceiver | Single-Chip Transceiver | ||||||||||||||||||||||||||||||||||
| CYP15G0101DXB-BBC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | BICMOS | 390mA | Non-RoHS Compliant | 2004 | /files/cypresssemiconductorcorp-cyp15g0101dxbbbc-datasheets-0427.pdf | 100-LBGA | 3.3V | 100 | 100 | LVTTL | not_compliant | 500mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | CY*15G01 | TELECOM CIRCUIT | 1 | NOT SPECIFIED | Network Interfaces | Not Qualified | Transceiver | 1 | ||||||||||||||||||||||||||||||||||
| PEF 3452 H V1.3 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 110mA | 2.45mm | ROHS3 Compliant | /files/infineontechnologies-pef3452hv13-datasheets-5614.pdf | 44-QFP | 44 | DS3, E3, STS-1 | e3 | MATTE TIN | YES | 3.13V~3.46V | QUAD | GULL WING | 260 | 3.3V | 0.8mm | PEF3452 | PCM TRANSCEIVER | NOT SPECIFIED | Digital Transmission Interfaces | 3.3V | 1 | Not Qualified | S-PQFP-G44 | Line Interface Unit (LIU) | |||||||||||||||||||||||||||||||||||||
| DS21554LBN+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 75mA | ROHS3 Compliant | 2003 | /files/maximintegrated-ds21354ln-datasheets-2737.pdf | 100-LQFP | 5V | 75mA | 100 | 10 Weeks | 100 | E1, HDLC, J1, T1 | yes | EAR99 | No | e3 | Matte Tin (Sn) | 4.75V~5.25V | QUAD | GULL WING | 260 | 5V | 0.5mm | DS21554 | 1 | 1.544 Mbps | Transceiver | Single-Chip Transceiver | ||||||||||||||||||||||||||||||||||
| CYP15G0101DXB-BBI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HOTlink II™ | Surface Mount | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | BICMOS | 390mA | Non-RoHS Compliant | 2005 | /files/cypresssemiconductorcorp-cyv15g0101dxbbbxi-datasheets-6522.pdf | 100-LBGA | 3.3V | 100 | 100 | LVTTL | No | 510mA | e0 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | CY*15G01 | INTERFACE CIRCUIT | 1 | Network Interfaces | Transceiver | 1 |
