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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Density | Pbfree Code | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Memory Type | Data Bus Width | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
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| MTFC16GAKAEEF-AAT | Micron Technology Inc. | $24.14 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 169-TFBGA | 128Gb 16G x 8 | Non-Volatile | 2.7V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC256T-M/MF | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -55°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1mm | ROHS3 Compliant | 2013 | 8-VDFN Exposed Pad | 6mm | 5mm | 8 | 5 Weeks | 8 | SPI, Serial | 256 kb | IT ALSO OPERATES AT FREQUENCY 5 MHZ AT SUPPLY VOLTAGE 2.5 TO 4.5 V | No | 1 | e3 | Matte Tin (Sn) | YES | 2.5V~5.5V | DUAL | 260 | 5V | 1.27mm | 25LC256 | 5.5V | 4.5V | 40 | 2/5V | 0.006mA | 256Kb 32K x 8 | Non-Volatile | 160 ns | 10MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||
| MT61K512M32KPA-16:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~95°C TC | Tape & Reel (TR) | 3 (168 Hours) | SGRAM - GDDR6 | ROHS3 Compliant | 180-TFBGA | 1.31V~1.391V | 16Gb 512M x 32 | Volatile | 8GHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S70GL02GT12FHBV23 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | GL-T | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.4mm | ROHS3 Compliant | 64-LBGA | 13mm | 11mm | 64 | 13 Weeks | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 1mm | 3.6V | 2.7V | NOT SPECIFIED | R-PBGA-B64 | AEC-Q100 | 2Gb 256M x 8 128M x 16 | Non-Volatile | 120ns | 3V | FLASH | Parallel | 128MX16 | 16 | 2147483648 bit | 8 | ||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1312KV18-250BZCT | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Synchronous, QDR II | 1.4mm | Non-RoHS Compliant | 2003 | 165-LBGA | 15mm | 1.8V | 165 | 13 Weeks | 165 | 18 Mb | no | 2 | PIPELINED ARCHITECTURE | No | 1 | 560mA | e0 | Tin/Lead (Sn/Pb) | 1.7V~1.9V | BOTTOM | 235 | 1.8V | 1mm | CY7C1312 | 1.9V | 1.7V | 20 | 18Mb 1M x 18 | Volatile | 3-STATE | 450 ps | 250MHz | 19b | SRAM | Parallel | 1MX18 | 18 | 18b | Synchronous | SEPARATE | 1.7V | ||||||||||||||||||||||||||||||||||||
| MTFC16GAKAEEF-O1 AIT | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 169-TFBGA | 128Gb 16G x 8 | Non-Volatile | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT53E384M32D2DS-046 AAT:E | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR4 | ROHS3 Compliant | 200-WFBGA | 0.6V 1.1V | 12Gb 384M x 32 | Volatile | 2.133GHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1230WP-150+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds1230w100-datasheets-6581.pdf | 34-PowerCap™ Module | 25.019mm | 23.495mm | Lead Free | 34 | 6 Weeks | yes | EAR99 | 10 YEAR DATA RETENTION | not_compliant | 8473.30.11.40 | 1 | e3 | MATTE TIN | NO | 3V~3.6V | DUAL | 245 | 3.3V | 1.27mm | DS1230W | 34 | 3.6V | 3V | 40 | SRAMs | 3.3V | 0.05mA | Not Qualified | R-XDMA-P34 | 256Kb 32K x 8 | Non-Volatile | NVSRAM | Parallel | 256KX8 | 8 | 150ns | 2097152 bit | 0.00025A | 150 ns | ||||||||||||||||||||||||||||||||||
| IS43TR16512AL-15HBLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~95°C TC | Tray | 3 (168 Hours) | SDRAM - DDR3L | SYNCHRONOUS | 1.4mm | ROHS3 Compliant | 96-LFBGA | 14mm | 1.35V | 96 | 12 Weeks | 96 | 8 Gb | 1 | AUTO/SELF REFRESH | Copper, Silver, Tin | 1.333GHz | 1 | e1 | 1.283V~1.45V | BOTTOM | 260 | 1.5V | 0.8mm | 1.575V | 1.425V | 10 | 8Gb 512M x 16 | Volatile | 16b | 20ns | 667MHz | 15b | DRAM | Parallel | 512MX16 | 16 | 15ns | ||||||||||||||||||||||||||||||||||||||||||
| MT29F512G08EBHBFJ4-R:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 132-VBGA | 8 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S99-50481 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 12 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY14V104NA-BA45XI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | NVSRAM (Non-Volatile SRAM) | 1.2mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-cy14v104laba45xi-datasheets-5211.pdf | 48-TFBGA | 10mm | 3.3V | 48 | 10 Weeks | 48 | 4 Mb | 3A991.B.2.A | No | 8542.32.00.41 | 1 | 52mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 260 | 3.3V | 0.75mm | CY14V104 | 48 | 3.6V | 3V | 30 | SRAMs | 4Mb 256K x 16 | Non-Volatile | 16b | NVSRAM | Parallel | 256KX16 | 16 | 45ns | 0.008A | 16b | 45 ns | |||||||||||||||||||||||||||||||||||||
| MT29F512G08EBHAFB17A3WC1-R | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Bulk | 3 (168 Hours) | FLASH - NAND (TLC) | ROHS3 Compliant | Die | 512Gb 64G x 8 | Non-Volatile | FLASH | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS49NLC36800-33WBLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 144-TBGA | 18.5mm | 11mm | 144 | 14 Weeks | 1 | EAR99 | AUTO REFRESH | 1 | YES | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 1mm | 1.9V | 1.7V | NOT SPECIFIED | R-PBGA-B144 | 288Mb 8M x 36 | Volatile | 20ns | 300MHz | DRAM | Parallel | 8MX36 | 36 | 301989888 bit | |||||||||||||||||||||||||||||||||||||||||||||||
| CY14V104LA-BA25XIT | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-cy14v104laba45xi-datasheets-5211.pdf | 48-TFBGA | 10mm | 3.3V | 48 | 10 Weeks | 48 | 4 Mb | 3A991.B.2.A | 8542.32.00.41 | 1 | 70mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 260 | 3.3V | 0.75mm | 48 | 3.6V | 3V | 30 | SRAMs | Not Qualified | 4Mb 512K x 8 | Non-Volatile | 8b | NVSRAM | Parallel | 512KX8 | 8 | 25ns | 0.008A | 8b | 25 ns | |||||||||||||||||||||||||||||||||||||
| MT35XU02GCBA1G12-0AAT | Micron Technology Inc. | $31.37 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Xccela™ - MT35X | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 24-TBGA | 8mm | 6mm | 24 | 8 Weeks | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 1.7V~2V | BOTTOM | 260 | 1.8V | 1mm | 2V | 1.7V | 30 | R-PBGA-B24 | AEC-Q100 | 2Gb 256M x 8 | Non-Volatile | 1.8V | 200MHz | FLASH | Xccela Bus | 2GX1 | 1 | 2147483648 bit | SERIAL | ||||||||||||||||||||||||||||||||||||||||||||
| MT52L256M64D2QB-125 XT:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS64WV102416BLL-10CTLA3-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | 10 Weeks | 48 | 2.4V~3.6V | 16Mb 1M x 16 | Volatile | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F512G08EBHBFJ4-R:B | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 132-VBGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1230WP-100+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds1230w100-datasheets-6581.pdf | 34-PowerCap™ Module | 25.019mm | 23.495mm | Lead Free | 34 | 6 Weeks | yes | EAR99 | 10 YEAR DATA RETENTION | not_compliant | 8473.30.11.40 | 1 | e3 | MATTE TIN | NO | 3V~3.6V | DUAL | 245 | 3.3V | 1.27mm | DS1230W | 34 | 3.6V | 3V | 40 | SRAMs | 3.3V | 0.05mA | Not Qualified | R-XDMA-P34 | 256Kb 32K x 8 | Non-Volatile | NVSRAM | Parallel | 256KX8 | 8 | 100ns | 2097152 bit | 0.00025A | 100 ns | ||||||||||||||||||||||||||||||||||
| MT53E384M32D2DS-053 AIT:E TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~95°C TC | Tape & Reel (TR) | 3 (168 Hours) | SDRAM - Mobile LPDDR4 | ROHS3 Compliant | 200-WFBGA | 0.6V 1.1V | 12Gb 384M x 32 | Volatile | 1.866GHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MTFC16GAKAEEF-O1 AIT TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 169-TFBGA | 128Gb 16G x 8 | Non-Volatile | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT35XU02GCBA2G12-0AAT | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Xccela™ - MT35X | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 24-TBGA | 8mm | 6mm | 24 | 7 Weeks | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 1.7V~2V | BOTTOM | 260 | 1.8V | 1mm | 2V | 1.7V | 30 | R-PBGA-B24 | AEC-Q100 | 2Gb 256M x 8 | Non-Volatile | 1.8V | 200MHz | FLASH | Xccela Bus | 256MX8 | 8 | 2147483648 bit | SERIAL | |||||||||||||||||||||||||||||||||||||||||||||
| MTFC16GAKAEEF-AAT TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 169-TFBGA | 5 Weeks | 128Gb 16G x 8 | Non-Volatile | FLASH | MMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29F512G08EECAGJ4-5M:A TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 5 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V67602S150BGG | Renesas Electronics America Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SRAM - Synchronous, SDR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamericainc-71v67602s166pfg8-datasheets-8866.pdf | 119-BGA | 10 Weeks | 3.135V~3.465V | IDT71V67602 | 119-PBGA (14x22) | 9Mb 256K x 36 | Volatile | 3.8ns | 150MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71T75802S200PFG8 | Renesas Electronics America Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Synchronous, SDR (ZBT) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamericainc-71t75602s166pfg-datasheets-1878.pdf | 100-LQFP | 14 Weeks | 2.375V~2.625V | IDT71T75 | 100-TQFP (14x14) | 18Mb 1M x 18 | Volatile | 3.2ns | 200MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1230W-100IND+ | Maxim Integrated | $24.65 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 10.668mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds1230w100-datasheets-6581.pdf | 28-DIP Module (0.600, 15.24mm) | 38.225mm | 15.24mm | 28 | 6 Weeks | yes | EAR99 | 10 YEAR DATA RETENTION | 8473.30.11.40 | 1 | e3 | MATTE TIN | NO | 3V~3.6V | DUAL | NOT SPECIFIED | 3.3V | 2.54mm | DS1230W | 28 | 3.6V | 3V | NOT SPECIFIED | SRAMs | 3.3V | 0.05mA | Not Qualified | R-PDIP-T28 | 256Kb 32K x 8 | Non-Volatile | NVSRAM | Parallel | 256KX8 | 8 | 100ns | 2097152 bit | 0.00025A | 100 ns | ||||||||||||||||||||||||||||||||||
| MT52L256M64D2QA-125 XT:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V67603S150BGI | Renesas Electronics America Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | SRAM - Synchronous, SDR | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamericainc-71v67603s133bqgi8-datasheets-2259.pdf | 119-BGA | 13 Weeks | 3.135V~3.465V | IDT71V67603 | 119-PBGA (14x22) | 9Mb 256K x 36 | Volatile | 3.8ns | 150MHz | SRAM | Parallel |
