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1 Circuit 750MHz 1:6 Clock Buffer 32-VFQFN Exposed Pad
- Manufacturer: Microchip Technology
- NO: 536-ZL40216LDF1
- Package: 32-VFQFN Exposed Pad
- Datasheet:
- Stock: 2953
- Description: 1 Circuit 750MHz 1:6 Clock Buffer 32-VFQFN Exposed Pad(Kg)
- Delivery:
- Payment:
In Stock
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| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Mounting Type | Surface Mount |
| Package / Case | 32-VFQFN Exposed Pad |
| Supplier Device Package | 32-QFN (5x5) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | Fanout Buffer (Distribution) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Voltage - Supply | 2.375V~3.465V |
| Output | LVDS |
| Number of Circuits | 1 |
| Propagation Delay | 2 ns |
| Frequency (Max) | 750MHz |
| Input | CML, HCSL, LVCMOS, LVDS, LVPECL |
| Ratio - Input:Output | 1:6 |
| Differential - Input:Output | Yes/Yes |
| Max Duty Cycle | 5 % |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
ZL40216LDF1 Overview
There is a case option of 32-VFQFN Exposed Pad available for this clock divider. In case Tape & Reel (TR), the cut smart buffer is available. The maximum value for normal operation is 750MHz. As you can see, it is mounted by Surface Mount. This electronic part is classified as Fanout Buffer (Distribution). When the temperature is set to -40°C~85°C, reliable performance is ensured. Ideally, it should be able to operate from 2.375V~3.465V volts. Its output is LVDS. For maintaining reliability, it should be operated at a temperature of -40°C. Temperatures below 85°C allow stable operation.
ZL40216LDF1 Features
The operating temperature of -40°C~85°C degrees
ZL40216LDF1 Applications
There are a lot of Microchip Technology ZL40216LDF1 Clock Buffers & Drivers applications.
- Data transmission
- Automatic test equipment
- DDR4 JEDEC standard RDIMM design
- Smartphone
- High-performance server
- Internet of Things
- Hardware accelerator
- High speed instrument
- Medical imaging
- Big data
