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1 Circuit 750MHz 1:2 Clock Buffer 16-VFQFN Exposed Pad
- Manufacturer: Microchip Technology
- NO: 536-ZL40212LDF1
- Package: 16-VFQFN Exposed Pad
- Datasheet:
- Stock: 8879
- Description: 1 Circuit 750MHz 1:2 Clock Buffer 16-VFQFN Exposed Pad(Kg)
- Delivery:
- Payment:
In Stock
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| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Mounting Type | Surface Mount |
| Package / Case | 16-VFQFN Exposed Pad |
| Supplier Device Package | 16-QFN (3x3) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | Fanout Buffer (Distribution) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Voltage - Supply | 2.375V~3.465V |
| Output | LVDS |
| Number of Circuits | 1 |
| Propagation Delay | 2 ns |
| Frequency (Max) | 750MHz |
| Input | CML, HCSL, LVCMOS, LVDS, LVPECL |
| Ratio - Input:Output | 1:2 |
| Differential - Input:Output | Yes/Yes |
| Max Duty Cycle | 5 % |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
ZL40212LDF1 Overview
There is a case available for the cut smart buffer in 16-VFQFN Exposed Pad. It is packaged as a Tape & Reel (TR). It is recommended that the maximum value for normal operation is 750MHz. As far as I can tell, it is mounted by Surface Mount. An electronic component classified as Fanout Buffer (Distribution) is categorized as such. If you wish to ensure reliable performance, you should set the temperature to -40°C~85°C. 2.375V~3.465V V power should work with it. There is LVDS output from clock driver. For maintaining reliability, it should be operated at a temperature of -40°C. It is possible to achieve stable operation by setting the maximum operating temperature to 85°C.
ZL40212LDF1 Features
The operating temperature of -40°C~85°C degrees
ZL40212LDF1 Applications
There are a lot of Microchip Technology ZL40212LDF1 Clock Buffers & Drivers applications.
- Furniture
- Artificial intelligence
- High performance communication system
- Edge computing
- Tlecom applications
- DDR4 JEDEC standard LRDIMM design
- Cloud computing
- Clock signal duplication
- Medical imaging
- Peak detection
