Products
Manufacturer
RFQ
NEWS
ContactXCZU3EG-1SFVC784I
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O
- Manufacturer: Xilinx
- NO: 903-XCZU3EG-1SFVC784I
- Package: 784-BFBGA, FCBGA
- Datasheet:
- Stock: 252
- Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O(Kg)
- Delivery:
- Payment:
In Stock
Please send RFQ , we will respond immediately.
.png)
.png)
.png)
.png)
.png)
.png)
.png)
.png)
.png)
You may place an order without registering to Chip Smart.
We strongly suggest you sign in before purchasing as you
can track your order in real time.
For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.
RFQ (Request for Quotations)It is recommended to request for quotations to get the latest
prices and inventories about the part.
Our sales will reply to
your request by email within 24 hours.
1. You'll receive an order information email in your inbox.
(Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some
extent, the sales manager is going to reconfirm the order and let you know if there
are any updates.
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time
zone and country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RoHS Status | ROHS3 Compliant |
| Package / Case | 784-BFBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Number of I/O | 252 |
| Architecture | MCU, FPGA |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Introducing the XCZU3EG-1SFVC784I: A Revolutionary Solution for High-Performance Applications
The XCZU3EG-1SFVC784I is a breakthrough product designed to provide unrivaled performance, versatility and efficiency for a variety of applications. With its innovative features and advanced technology, this product is sure to revolutionize the industry and help professionals achieve new heights of productivity.
Describe:
The XCZU3EG-1SFVC784I is a cutting-edge device that combines the power of a field-programmable gate array (FPGA) with a system-on-chip (SoC) architecture, making it ideal for demanding applications. Its seamless integration of FPGA and processing power provides unmatched flexibility and performance for various industries such as telecommunications, automotive, aerospace and more.
Feature:
One of the key features of the XCZU3EG-1SFVC784I is its superior processing capability. The device features a high-performance, low-power Arm® Cortex®-A53 processor for fast data processing and seamless integration with software applications. This unique combination enables complex algorithms to be processed in real time and facilitates the development of advanced machine learning and artificial intelligence applications.
In addition, the XCZU3EG-1SFVC784I has a wide range of programmable logic cells, enabling users to customize the device according to their specific requirements. This adaptability is further enhanced by its wide range of available input/output interfaces, allowing seamless integration with peripherals and ensuring compatibility across a wide variety of systems.
Application:
The XCZU3EG-1SFVC784I's impressive features make it ideal for a wide variety of applications. In the telecommunications industry, this product can be used to develop advanced network systems, achieve faster data transmission rates and improve network efficiency. Its high-performance processing capabilities also make it an invaluable asset in the automotive sector, facilitating the development of autonomous driving technologies and enhancing vehicle connectivity.
Additionally, the XCZU3EG-1SFVC784I has great utility in aerospace applications. Its rugged design and ability to withstand harsh environments make it a reliable choice for aerospace manufacturers, enabling them to enhance mission-critical systems and improve overall operational efficiency.
In the field of scientific research, the product opens up new possibilities for data analysis, simulation and modeling. Scientists and researchers can use its remarkable computing power to process massive amounts of data, perform complex calculations and accelerate scientific discoveries in genomics, climate research and more.
In conclusion, the XCZU3EG-1SFVC784I is a game-changing product that delivers unrivaled performance and versatility for countless applications. Its powerful processing power, combined with its adaptability and wide range of interfaces, make it an invaluable tool for professionals in various industries. With this revolutionary device, users can push boundaries, drive innovation, and unlock the potential of their projects like never before.
