TE0808-04-09EG-1EL

TE0808-04-09EG-1EL datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available at Feilidi


  • Manufacturer: Trenz Electronic GmbH
  • NO: 816-TE0808-04-09EG-1EL
  • Package: -
  • Datasheet: pdf
  • Stock: 1994
  • Description: TE0808-04-09EG-1EL datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Operating Temperature 0°C~85°C
Series TE0808
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 4GB
Core Processor Zynq UltraScale+ XCZU9EG-1FFVC900E
Module/Board Type MPU Core
Flash Size 128MB
RoHS Status ROHS3 Compliant

TE0808-04-09EG-1EL Overview


A MPU Core-type board or module is used in this microcontroller.There are Zynq UltraScale+ XCZU9EG-1FFVC900E cores in its processor, which is what powers the microcontroller.It is important to note that the microcontroller is set to 0°C~85°C as the default setting.The MCU electronics's size of flash is 128MB.B2B' stands for connector type.MCU chip belongs to the TE0808 Series.This is 4GB in order to guarantee that the software runs normally.

TE0808-04-09EG-1EL Features


Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E
Flash size of 128MB

TE0808-04-09EG-1EL Applications


There are a lot of Trenz Electronic GmbH TE0808-04-09EG-1EL Microcontroller, Microprocessor, FPGA Modules applications.

  • Healthcare Monitoring
  • Industrial Automation
  • Industrial Gateways
  • Industrial Instrumentation
  • Process Control
  • IoT Secure Gateways
  • Software Defined Radio
  • Human Machine Control Panel
  • Test and Measurement
  • Network Enabled Data Acquisition

In Stock

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