TC7SG17FU(TE85L,F)

Clock Buffer DUAL SSOP


  • Manufacturer: Toshiba
  • NO: 4669-TC7SG17FU(TE85L,F)
  • Package: SSOP
  • Datasheet: -
  • Stock: 3441
  • Description: Clock Buffer DUAL SSOP(Kg)

Quantity:


  • Delivery: Delivery
  • Payment: payment

In Stock

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport

SPECIFICATIONS

Parameters
Packing Method TAPE AND REEL
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Operating Temperature (Min) -40°C
Polarity Non-Inverting
Power Supplies 1.2/3.3V
Temperature Grade INDUSTRIAL
Load Capacitance 30pF
Logic Function Buffer, Schmitt Trigger
Max I(ol) 0.0003 A
Schmitt Trigger YES
Radiation Hardening No
RoHS Status RoHS Compliant
Package / Case SSOP
Surface Mount YES
Number of Pins 5
Packaging Tape & Reel
Number of Terminations 5
Subcategory Gates

TC7SG17FU(TE85L,F) Overview


There is a case option of SSOP available for this clock divider. Tape & Reel is the form in which it is packaged. A total of 5 terminations are present. A 5 pin is used for operation. The circuit clock is contained in Gates. There is a 1.2/3.3V volt supply that powers the timeing clock. As part of its reliability, it operates at a minimum of -40°C degrees Celsius. This method employs the TAPE AND REEL packing method.

TC7SG17FU(TE85L,F) Features


5 terminations
Gates subcategory

TC7SG17FU(TE85L,F) Applications


There are a lot of Toshiba TC7SG17FU(TE85L,F) Clock Buffers & Drivers applications.

  • Handheld test instruments
  • DDR4 JEDEC standard LRDIMM design
  • Consumer Electronics
  • Internet of Things
  • Cloud computing
  • High speed instrument
  • Mobile Internet Device (MID)
  • Synchronous digital system
  • Host bus adapter card
  • High-speed flip-flop

In Stock

Please send RFQ , we will respond immediately.