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1 Circuit 2GHz 2:5 Clock Buffer SY100EP14 100EP, Precision Edge?, ECL Pro? Series 20-TSSOP (0.173, 4.40mm Width)
- Manufacturer: Microchip Technology
- NO: 536-SY100EP14UK4I-TR
- Package: 20-TSSOP (0.173, 4.40mm Width)
- Datasheet:
- Stock: 3999
- Description: 1 Circuit 2GHz 2:5 Clock Buffer SY100EP14 100EP, Precision Edge?, ECL Pro? Series 20-TSSOP (0.173, 4.40mm Width)(Kg)
- Delivery:
- Payment:
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| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 20-TSSOP (0.173, 4.40mm Width) |
| Supplier Device Package | 20-TSSOP |
| Operating Temperature | -40°C~85°C |
| Packaging | Tape & Reel (TR) |
| Published | 2000 |
| Series | 100EP, Precision Edge®, ECL Pro® |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Fanout Buffer (Distribution), Multiplexer |
| Voltage - Supply | 2.37V~5.5V |
| Base Part Number | SY100EP14 |
| Output | LVECL, LVPECL |
| Number of Circuits | 1 |
| Frequency (Max) | 2GHz |
| Input | HSTL, LVECL, LVPECL |
| Ratio - Input:Output | 2:5 |
| Differential - Input:Output | Yes/Yes |
| RoHS Status | Non-RoHS Compliant |
SY100EP14UK4I-TR Overview
As far as the case type is concerned, the cut smart buffer is available in 20-TSSOP (0.173, 4.40mm Width). The package is in the form of a Tape & Reel (TR). Normal operation is limited to 2GHz. It's?set?up?in?the?way?of?Surface Mount. The electrical component has a classification of Fanout Buffer (Distribution), Multiplexer. Setting the temperature to -40°C~85°C will ensure reliable performance. In order for it to function, a power source of 2.37V~5.5V V must be available. Buffer IC is LVECL, LVPECL that is output. There is a family of objects known as the SY100EP14. The 100EP, Precision Edge?, ECL Pro? series refers to this electrical component.
SY100EP14UK4I-TR Features
The operating temperature of -40°C~85°C degrees
SY100EP14UK4I-TR Applications
There are a lot of Microchip Technology SY100EP14UK4I-TR Clock Buffers & Drivers applications.
- Smartphone
- Consumer Electronics
- High speed instrument
- Big data
- Telecommunications
- High reliability telecommunication system
- Mobile Internet Device (MID)
- Ultra Mobile PC (UMPC)
- Artificial intelligence
- Wired communication field
