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| Parameters | |
|---|---|
| Package / Case | 100-LQFP |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C TA |
| Packaging | Tray |
| Series | STM32F4 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 100 |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 3V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | STM32F412 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 1.7V |
| Oscillator Type | Internal |
| Number of I/O | 81 |
| Speed | 100MHz |
| RAM Size | 256K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.7V~3.6V |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Core Processor | ARM® Cortex®-M4 |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT |
| Clock Frequency | 26MHz |
| Program Memory Type | FLASH |
| Core Size | 32-Bit |
| Program Memory Size | 512KB 512K x 8 |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB OTG |
| Bit Size | 32 |
| Data Converter | A/D 16x12b |
| Has ADC | YES |
| DMA Channels | YES |
| PWM Channels | YES |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 12 Weeks |
| Mounting Type | Surface Mount |
STM32F412XE/G devices are based on the high-performance Arm? Cortex? -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex?-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. STM32F412XE/G devices belong to the STM32 Dynamic Efficiency? product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.
? Dynamic Efficiency Line with BAM (Batch
Acquisition Mode)
? Core: Arm? 32-bit Cortex?-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator?) allowing 0-wait state execution
from Flash memory, frequency up to 100 MHz,
memory protection unit,
125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1),
and DSP instructions
? Memories
– Up to 1 Mbyte of Flash memory
– 256 Kbyte of SRAM
– Flexible external static memory controller
with up to 16-bit data bus: SRAM, PSRAM,
NOR Flash memory
– Dual mode Quad-SPI interface
? LCD parallel interface, 8080/6800 modes
? Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
? Power consumption
– Run: 112 μA/MHz (peripheral off)
– Stop (Flash in Stop mode, fast wakeup
time): 50 μA Typ @ 25 °C; 75 μA max
@25 °C
– Stop (Flash in Deep power down mode,
slow wakeup time): down to 18 μA @
25 °C; 40 μA max @25 °C
– Standby: 2.4 μA @25 °C / 1.7 V without
RTC; 12 μA @85 °C @1.7 V
– VBAT supply for RTC: 1 μA @25 °C
? 1×12-bit, 2.4 MSPS ADC: up to 16 channels
? 2x digital filters for sigma delta modulator,
4x PDM interfaces, stereo microphone support
? General-purpose DMA: 16-stream DMA
? Motor drive and application control
? Medical equipment
? Industrial applications: PLC, inverters, circuit breakers
? Printers, and scanners
? Alarm systems, video intercom, and HVAC
? Home audio appliances
? Mobile phone sensor hub
? Wearable devices
? Connected objects
? Wifi modules
Please send RFQ , we will respond immediately.