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ContactSI8900EDB-T2-E1
MOSFET 2N-CH 20V 5.4A 10-MFP
- Manufacturer: Vishay Siliconix
- NO: 880-SI8900EDB-T2-E1
- Package: 10-UFBGA, CSPBGA
- Datasheet:
- Stock: 554
- Description: MOSFET 2N-CH 20V 5.4A 10-MFP(Kg)
- Delivery:
- Payment:
In Stock
Please send RFQ , we will respond immediately.
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
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The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | SI8900 |
| Pin Count | 10 |
| Qualification Status | Not Qualified |
| Number of Elements | 2 |
| Element Configuration | Dual |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 1W |
| FET Type | 2 N-Channel (Dual) Common Drain |
| Vgs(th) (Max) @ Id | 1V @ 1.1mA |
| Current - Continuous Drain (Id) @ 25°C | 5.4A |
| Rise Time | 4.5μs |
| Fall Time (Typ) | 4.5 μs |
| Turn-Off Delay Time | 55 μs |
| Continuous Drain Current (ID) | 7A |
| Gate to Source Voltage (Vgs) | 12V |
| Drain Current-Max (Abs) (ID) | 5.4A |
| Drain to Source Breakdown Voltage | 20V |
| FET Technology | METAL-OXIDE SEMICONDUCTOR |
| FET Feature | Logic Level Gate |
| Drain to Source Resistance | 24mOhm |
| Rds On Max | 24 mΩ |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 13 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 10-UFBGA, CSPBGA |
| Number of Pins | 10 |
| Transistor Element Material | SILICON |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| Series | TrenchFET® |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 10 |
| ECCN Code | EAR99 |
| Resistance | 40mOhm |
| Terminal Finish | TIN SILVER COPPER |
| Subcategory | FET General Purpose Power |
| Max Power Dissipation | 1W |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
