MK10DN512VMD10

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K10 Series MK10DN512 3.3V 144-LBGA


  • Manufacturer: NXP USA Inc.
  • NO: 318-MK10DN512VMD10
  • Package: 144-LBGA
  • Datasheet: pdf
  • Stock: 5018
  • Description: 512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K10 Series MK10DN512 3.3V 144-LBGA (Kg)

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SPECIFICATIONS

Parameters
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 144-LBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2002
Series Kinetis K10
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
ECCN Code 3A991.A.2
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Subcategory Microcontrollers
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MK10DN512
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Number of I/O 104
Speed 100MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 32MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Supply Current-Max 77mA
Bit Size 32
Data Converter A/D 46x16b; D/A 2x12b
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
ROM (words) 524288
CPU Family CORTEX-M4
Height Seated (Max) 1.7mm
Length 13mm
Width 13mm
RoHS Status ROHS3 Compliant

MK10DN512VMD10 Description


The MK10DN512VMD10 is a Kinetis? K10-100 MHz, Mixed-Signal Integration Microcontrollers (MCUs) based on Arm? Cortex?-M4 Core. There are numerous memory and integration options for these general-purpose MCUs. FlexMemory Its flexible, low-power, energy-efficient features assist embedded designers in resolving many of their most pressing problems. The flash memory capacity of devices ranges from 32 KB in a 5x5 mm 32 QFN package with a compact footprint to 1 MB in a 144 MAPBGA package with a variety of optional peripherals, including analog, communication, timing, and control.

A wide range of software and development tools are available to complement the Kinetis MCU family.



MK10DN512VMD10 Features


  • Security and integrity modules

– Hardware CRC module to support fast cyclic redundancy checks

– 128-bit unique identification (ID) number per chip

  • Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

  • Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64) integrated into each ADC

– Two 12-bit DACs

– Two transimpedance amplifiers

– Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input

– Voltage reference

  • Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM timer

– Two 2-channel quadrature decoder/general purpose timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

  • Communication interfaces

– Two Controller Area Network (CAN) modules

– Three SPI modules

– Two I2C modules

– Six UART modules

– Secure Digital host controller (SDHC)

– I2S module

  • Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

  • Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

  • Memories and memory interfaces

– Up to 512 KB program flash memory on nonFlexMemory devices

– Up to 256 KB program flash memory on FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

  • Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

  • System peripherals

– Multiple low-power modes to provide power optimization based on application requirements

– Memory protection unit with multi-master protection

– 16-channel DMA controller, supporting up to 63 request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit



MK10DN512VMD10 Applications


  • Light sensing & controlling devices

  • Temperature sensing and controlling devices

  • Fire detection & safety devices

  • Industrial instrumentation devices

  • Process control devices


In Stock

Please send RFQ , we will respond immediately.