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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 7 months ago) |
| Mounting Type | Surface Mount |
| Package / Case | 14-VFLGA Module |
| Surface Mount | YES |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tape & Reel (TR) |
| Series | iNEMO |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 14 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BUTT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | ISM3 |
| JESD-30 Code | R-PBGA-B14 |
| Output Type | I2C, SPI |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 1.62V |
| Analog IC - Other Type | ANALOG CIRCUIT |
| Sensor Type | Accelerometer, Gyroscope, Temperature, 6 Axis |
| Height | 860μm |
| Length | 3mm |
| Width | 2.5mm |
| RoHS Status | RoHS Compliant |
High-performance 3D digital accelerometer and 3D digital gyroscope are featured in the system-in-package known as the ISM330DLCTR, which is designed for Industry 4.0 applications.
The dependable and established MEMS sensor platform is used by ST's range of modules.
already-existing manufacturing techniques for micromachined an accelerometer and a gyroscope.
While the IC interfaces are created using CMOS technology, which enables the construction of a dedicated circuit that is trimmed to better match the sensing element's properties, the individual sensing elements are produced using specialized micromachining procedures.
The sensor components for the gyroscope and accelerometer are integrated on the same silicon die in the ISM330DLCTR, which ensures greater stability and robustness.
Smart FIFO up to 4 kbyte
Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
Sensor hub feature to efficiently collect data from additional external sensors
Embedded hard, soft ironing for external magnetic sensor corrections
Embedded temperature sensor
Embedded self-test both for gyroscope and accelerometer
High shock survivability
Extended operating temperature range (-40 °C to +85 °C)
ECOPACK®, RoHS and “Green” compliant
3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
D gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
Analog supply voltage: 1.71 V to 3.6 V
SPI & I²C serial interface with main processor data synchronization
Dedicated gyroscope output chain with low latency, low noise and dedicated low-pass filters for control loop stability (OIS and other stabilization applications)
Auxiliary SPI serial interface for independent, low-noise low-latency data output for gyroscope and accelerometer
Ultra-low power consumption for both accelerometer and gyroscope enabling long-lasting battery-operated applications: 0.5 mA in combo normal mode and 0.75 mA in combo high-performance mode
Robotics, drones and industrial automation
Navigation systems and telematics
Vibration monitoring and compensation
Industrial IoT and connected devices
Antennas, platforms, and optical image and lens stabilization
Please send RFQ , we will respond immediately.