IRFHM792TRPBF

IRFHM792TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRFHM792TRPBF
  • Package: 8-PowerVDFN
  • Datasheet: pdf
  • Stock: 7512
  • Description: IRFHM792TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Drain to Source Breakdown Voltage 100V
Pulsed Drain Current-Max (IDM) 14A
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Standard
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerVDFN
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2013
Series HEXFET®
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Subcategory FET General Purpose Power
Max Power Dissipation 2.3W
Base Part Number IRFHM792PBF
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.3W
Case Connection DRAIN
Turn On Delay Time 3.4 ns
FET Type 2 N-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 195m Ω @ 2.9A, 10V
Vgs(th) (Max) @ Id 4V @ 10μA
Input Capacitance (Ciss) (Max) @ Vds 251pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 6.3nC @ 10V
Rise Time 4.7ns
Drain to Source Voltage (Vdss) 100V
Fall Time (Typ) 2.6 ns
Turn-Off Delay Time 5.2 ns
Continuous Drain Current (ID) 2.3A
Gate to Source Voltage (Vgs) 20V
Drain Current-Max (Abs) (ID) 3.4A
Drain-source On Resistance-Max 0.195Ohm

IRFHM792TRPBF Description


The IRFHM792TRPBF combines cutting-edge DirectFETTM packaging with the most modern HEXFET? Power MOSFET Silicon technology. When application note AN-1035 defining the manufacturing procedures and methods is followed, the DirectFET package is compatible with the layout geometries currently used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques. The DirectFET package's two-sided cooling reduces thermal resistance by 80% compared to the prior-best while boosting thermal transfer in power systems.



IRFHM792TRPBF Features


  • RDS low on (v195m (2)

  • (v 129/W) Low Thermal Resistance to PCB

  • (v1.2mm) Low Profile

  • Business Standard Pinout

  • Compatibility with Current Surface Mount Methods

  • No Lead, Bromide, or Haloqen MSL1, Industrial Qualification, RoHS Compliant



IRFHM792TRPBF Applications


? Primary DC-DC Switch


? Battery Monitoring for 48V


In Stock

Please send RFQ , we will respond immediately.