IRF9956TRPBF

IRF9956TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF9956TRPBF
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 4743
  • Description: IRF9956TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Additional Feature AVALANCHE RATED, HIGH RELIABILITY
Voltage - Rated DC 20V
Max Power Dissipation 2W
Terminal Form GULL WING
Current Rating 3.5A
Base Part Number IRF9956PBF
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 2W
Turn On Delay Time 6.2 ns
FET Type 2 N-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 100m Ω @ 2.2A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 190pF @ 15V
Gate Charge (Qg) (Max) @ Vgs 14nC @ 10V
Rise Time 8.8ns
Fall Time (Typ) 3 ns
Turn-Off Delay Time 13 ns
Continuous Drain Current (ID) 3.5A
Gate to Source Voltage (Vgs) 20V
Drain-source On Resistance-Max 0.1Ohm
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 16A
Avalanche Energy Rating (Eas) 44 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 20 V
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Contains Lead, Lead Free
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2004
Series HEXFET®
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8

IRF9956TRPBF Description


International rectifier's fifth generation HEXFETs from the Infineon series use cutting-edge processing methods to deliver incredibly low silicon area resistance. This feature, along with the HEXFET power MOSFET's well-known fast switching speed and ruggedized device architecture, offering suitable level device for, gives designers an incredibly efficient and dependable device for use in a range of applications. Through the use of a unique lead frame, the SO-8 has been redesigned to have improved thermal properties and multiple-die capabilities, making it perfect for a range of power applications. With this enhancement, applications can leverage many devices while using significantly less board space. The container is made for infrared, vapour phase soldering methods.



IRF9956TRPBF Features


  • Generation V technology

  • Ultra low on resistance

  • Surface mount

  • Very low gate charge and switching losses

  • Fully avalanche rated

  • Dual N-channel MOSFET



IRF9956TRPBF Applications


  • Power Management

  • Consumer Electronics

  • Portable Devices

  • Industrial


In Stock

Please send RFQ , we will respond immediately.