IRF7907PBF

IRF7907PBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7907PBF
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 7094
  • Description: IRF7907PBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tube
Published 2006
Series HEXFET®
JESD-609 Code e3
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Subcategory FET General Purpose Power
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number IRF7907PBF
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Number of Elements 2
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode ENHANCEMENT MODE
Power - Max 2W
FET Type 2 N-Channel (Dual)
Rds On (Max) @ Id, Vgs 16.4m Ω @ 9.1A, 10V
Vgs(th) (Max) @ Id 2.35V @ 25μA
Input Capacitance (Ciss) (Max) @ Vds 850pF @ 15V
Current - Continuous Drain (Id) @ 25°C 9.1A 11A
Gate Charge (Qg) (Max) @ Vgs 10nC @ 4.5V
Drain to Source Voltage (Vdss) 30V
Drain Current-Max (Abs) (ID) 11A
Drain-source On Resistance-Max 0.0118Ohm
Pulsed Drain Current-Max (IDM) 85A
DS Breakdown Voltage-Min 30V
Avalanche Energy Rating (Eas) 15 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
Power Dissipation-Max (Abs) 2W
FET Feature Logic Level Gate
RoHS Status ROHS3 Compliant

IRF7907PBF Description


The IRF7907PBF combines cutting-edge DirectFETTM packaging and contemporary HEXFET? Power MOSFET Silicon technology. When application note AN-1035 defining the manufacturing procedures and methods is followed, the DirectFET package is compatible with the layout geometries currently used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques. In comparison to the previous-best, the DirectFET package's two-sided cooling increases heat transport in power systems while reducing thermal resistance by 80%.



IRF7907PBF Features


  • RDS(on) is Very Low at 4.5V VGS.

  • Small Gate Fee

  • Voltage and Current Characterized Avalanche in Full

  • Max. Gate Rating for 20V VGS

  • improved reverse recovery of the body diode

  • Completely tested for RG

  • Lead-Free



IRF7907PBF Applications


  • For POL, two SO-8 MOSFETs

  • Converters for servers, notebook computers, and

  • Game consoles, graphics cards, and set-top boxes


In Stock

Please send RFQ , we will respond immediately.