IRF7905PBF

IRF7905PBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7905PBF
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 3551
  • Description: IRF7905PBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Supplier Device Package 8-SO
Operating Temperature -55°C~150°C TJ
Packaging Tube
Published 2004
Series HEXFET®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Resistance 21.8MOhm
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Voltage - Rated DC 30V
Max Power Dissipation 2W
Current Rating 7.8A
Base Part Number IRF7905PBF
Number of Elements 2
Element Configuration Dual
Power Dissipation 2W
Power - Max 2W
FET Type 2 N-Channel (Dual)
Rds On (Max) @ Id, Vgs 21.8mOhm @ 7.8A, 10V
Vgs(th) (Max) @ Id 2.25V @ 25μA
Input Capacitance (Ciss) (Max) @ Vds 600pF @ 15V
Current - Continuous Drain (Id) @ 25°C 7.8A 8.9A
Gate Charge (Qg) (Max) @ Vgs 6.9nC @ 4.5V
Rise Time 9.3ns
Drain to Source Voltage (Vdss) 30V
Fall Time (Typ) 3.4 ns
Turn-Off Delay Time 8.1 ns
Continuous Drain Current (ID) 8.9A
Threshold Voltage 1.8V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 30V
Input Capacitance 600pF
Recovery Time 15 ns
FET Feature Logic Level Gate
Drain to Source Resistance 21.3mOhm
Rds On Max 21.8 mΩ
Nominal Vgs 1.8 V
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
Mount Surface Mount
Mounting Type Surface Mount

IRF7905PBF Description


Modern HEXFET? Power MOSFET Silicon technology and cutting-edge DirectFETTM packaging are combined in the IRF7905PBF. The DirectFET package is compatible with the layout geometries currently used in power applications, PCB assembly machinery, and vapor phase, infrared, or convection soldering techniques when application note AN-1035 outlining the manufacturing procedures and methods is followed. The DirectFET package's two-sided cooling improves heat transmission in power systems while reducing thermal resistance by 80% when compared to the prior-best.



IRF7905PBF Features


  • RDS(on) is Very Low at 4.5V VGS.

  • Small Gate Fee

  • Voltage and Current Characterized Avalanche in Full

  • Max. Gate Rating for 20V VGS

  • improved reverse recovery of the body diode

  • Completely tested for RG

  • Lead-Free



IRF7905PBF Applications


  • POL dual SO-8 MOSFET

  • Converters for servers, notebook computers, and

  • Game consoles, graphics cards, and set-top boxes


In Stock

Please send RFQ , we will respond immediately.