IRF7904TRPBF

IRF7904TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7904TRPBF
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 9135
  • Description: IRF7904TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Continuous Drain Current (ID) 11A
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 30V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Factory Lead Time 12 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2006
Series HEXFET®
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 16.2MOhm
Subcategory FET General Purpose Power
Max Power Dissipation 2W
Terminal Form GULL WING
Base Part Number IRF7904PBF
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 2W
Power - Max 1.4W 2W
FET Type 2 N-Channel (Dual)
Rds On (Max) @ Id, Vgs 16.2m Ω @ 7.6A, 10V
Vgs(th) (Max) @ Id 2.25V @ 25μA
Input Capacitance (Ciss) (Max) @ Vds 910pF @ 15V
Current - Continuous Drain (Id) @ 25°C 7.6A 11A
Gate Charge (Qg) (Max) @ Vgs 11nC @ 4.5V

IRF7904TRPBF Description


International Rectifier's Fifth Generation HEXFETs use state-of-the-art manufacturing techniques to generate extremely low on-resistance per silicon area. The designe is provided with an extraordinarily efficient and reliable device for use in a variety of applications thanks to this feature as well as the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for. The SO-8 is ideal for a range of power applications thanks to its enhanced thermal characteristics and multiple-die capacity. The use of a leadframe that was especially created allowed for this alteration. This innovation significantly reduces the amount of board space required while enabling the use of several devices. The package is meant to be used in conjunction with vapor phase infrared technology or wave soldering.



IRF7904TRPBF Features


  • RDS(on) is Very Low at 4.5V VGS.

  • Small Gate Fee

  • Comprehensive Characterization of Avalanche Voltage and Current

  • Max. Gate Rating for 20V VGS

  • improved reverse recovery of the body diode

  • Completely tested to be RG Lead-Free



IRF7904TRPBF Applications


  • POL dual SO-8 MOSFET

  • Converters for servers, notebook computers, and

  • Game consoles, graphics cards, and set-top boxes


In Stock

Please send RFQ , we will respond immediately.