IRF7751TRPBF

IRF7751TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7751TRPBF
  • Package: 8-TSSOP (0.173, 4.40mm Width)
  • Datasheet: pdf
  • Stock: 4410
  • Description: IRF7751TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Current - Continuous Drain (Id) @ 25°C 4.5A
Gate Charge (Qg) (Max) @ Vgs 44nC @ 10V
Rise Time 16ns
Drain to Source Voltage (Vdss) 30V
Fall Time (Typ) 80 ns
Turn-Off Delay Time 155 ns
Continuous Drain Current (ID) -4.5A
Threshold Voltage -2.5V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage -30V
Dual Supply Voltage -30V
Input Capacitance 1.464nF
FET Feature Logic Level Gate
Drain to Source Resistance 35MOhm
Rds On Max 35 mΩ
Nominal Vgs -2.5 V
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Number of Pins 8
Supplier Device Package 8-TSSOP
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2006
Series HEXFET®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Max Power Dissipation 1W
Base Part Number IRF7751PBF
Number of Elements 2
Element Configuration Dual
Power Dissipation 1W
Turn On Delay Time 13 ns
Power - Max 1W
FET Type 2 P-Channel (Dual)
Rds On (Max) @ Id, Vgs 35mOhm @ 4.5A, 10V
Vgs(th) (Max) @ Id 2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1464pF @ 25V

IRF7751TRPBF    Description

 

  International Rectifier's HEXFET Power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged equipment design of International Rectifier, provides designers with extremely efficient and reliable equipment for battery and load management. Compared with the standard SO-8, the footprint of the TSSOP-8 package is reduced by 45%. This makes the TSSOP-8 an ideal device for space-constrained applications on printed circuit boards. The ultra-thin shape (< 1.2mm) makes it easy to install in extremely thin environments, such as portable electronics and PCMCIA cards.

 

IRF7751TRPBF     Featutres


advanced technology to achieve extremely low on-resistance per silicon area.

extremely efficient 

reliable equipment for battery 

load management


IRF7751TRPBF   Applications


This makes the TSSOP-8 an ideal device for space-constrained applications on printed circuit boards.


In Stock

Please send RFQ , we will respond immediately.