IRF7750TRPBF

IRF7750TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7750TRPBF
  • Package: 8-TSSOP (0.173, 4.40mm Width)
  • Datasheet: pdf
  • Stock: 4743
  • Description: IRF7750TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Number of Pins 8
Supplier Device Package 8-TSSOP
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2009
Series HEXFET®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Max Power Dissipation 1W
Base Part Number IRF7750PBF
Number of Elements 2
Element Configuration Dual
Power Dissipation 1W
Turn On Delay Time 15 ns
Power - Max 1W
FET Type 2 P-Channel (Dual)
Rds On (Max) @ Id, Vgs 30mOhm @ 4.7A, 4.5V
Vgs(th) (Max) @ Id 1.2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1700pF @ 15V
Current - Continuous Drain (Id) @ 25°C 4.7A
Gate Charge (Qg) (Max) @ Vgs 39nC @ 5V
Rise Time 54ns
Drain to Source Voltage (Vdss) 20V
Fall Time (Typ) 210 ns
Turn-Off Delay Time 180 ns
Continuous Drain Current (ID) 4.7A
Threshold Voltage -1.2V
Gate to Source Voltage (Vgs) 12V
Drain to Source Breakdown Voltage -20V
Dual Supply Voltage -20V
Input Capacitance 1.7nF
FET Feature Logic Level Gate
Drain to Source Resistance 55mOhm
Rds On Max 30 mΩ
Nominal Vgs -1.2 V
Height 1.0414mm
Length 3.0988mm
Width 4.4958mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant

IRF7750TRPBF     Description


International Rectifier's HEXFET Power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged equipment design of International Rectifier, provides designers with extremely efficient and reliable equipment for battery and load management. Compared with the standard SO-8, the footprint of the TSSOP-8 package is reduced by 45%. This makes the TSSOP-8 an ideal device for space-constrained applications on printed circuit boards. The ultra-thin shape (< 1.1 mm) makes it easy to install in extremely thin environments, such as portable electronics and PCMCIA cards.


IRF7750TRPBF      Features


 Ultra Low On-Resistance

 Dual P-Channel MOSFET

 Very Small SOIC Package

 Low Profile ( < 1.1mm)

 Available in Tape & Reel

 Lead-Free

 

IRF7750TRPBF     Applications


space-constrained applications on printed circuit boards


In Stock

Please send RFQ , we will respond immediately.