IRF7509TRPBF

IRF7509TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7509TRPBF
  • Package: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • Datasheet: pdf
  • Stock: 7787
  • Description: IRF7509TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 1998
Series HEXFET®
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Resistance 200mOhm
Additional Feature ULTRA LOW RESISTANCE
Max Power Dissipation 1.25W
Terminal Form GULL WING
Current Rating 2.7A
Base Part Number IRF7509PBF
Number of Elements 2
Number of Channels 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 1.25W
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 110m Ω @ 1.7A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 210pF @ 25V
Current - Continuous Drain (Id) @ 25°C 2.7A 2A
Gate Charge (Qg) (Max) @ Vgs 12nC @ 10V
Rise Time 12ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 9.3 ns
Turn-Off Delay Time 19 ns
Continuous Drain Current (ID) 2.7A
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 30V
FET Technology METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj) 150°C
FET Feature Logic Level Gate
Nominal Vgs 1 V
Height 1.11mm
Length 3.048mm
Width 3.048mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free

IRF7509TRPBF           Description


The fifth generation HEXFET of International Rectifier Company adopts advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient and reliable device for use in a variety of applications. The new Micro8 package covers only half the footprint of the standard SO-8, making it the smallest footprint available in the SOIC outline. This makes Micro8 an ideal device for applications with limited space on printed circuit boards. The ultra-thin shape of Micro8 (< 1.1 mm) makes it easy to adapt to extremely thin application environments, such as portable electronics and PCMCIA cards.


IRF7509TRPBF       Features


 Generation V Technology

 Ultra Low On-Resistance

 Dual N and P Channel MOSFET

 Very Small SOIC Package

 Low Profile (<1.1mm)

 Available in Tape & Reel

 Fast Switching

 Lead-Free

 

IRF7509TRPBF       Applications


provides designers with an extremely efficient and reliable device for use in a variety of applications.

 

  

 





In Stock

Please send RFQ , we will respond immediately.