IRF7389TRPBF

IRF7389TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7389TRPBF
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 6172
  • Description: IRF7389TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2004
Series HEXFET®
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 29mOhm
Additional Feature AVALANCHE RATED, ULTRA LOW RESISTANCE
Max Power Dissipation 2.5W
Terminal Position DUAL
Terminal Form GULL WING
Current Rating 7.3A
Base Part Number IRF7389PBF
Number of Elements 2
Row Spacing 6.3 mm
Number of Channels 1
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.5W
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 29m Ω @ 5.8A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 650pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 33nC @ 10V
Rise Time 13ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 32 ns
Turn-Off Delay Time 34 ns
Continuous Drain Current (ID) 7.3A
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 30A
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 1 V
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Contains Lead, Lead Free
Factory Lead Time 12 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount

IRF7389TRPBF Description


In order to produce extraordinarily low on-resistance per silicon area, International Rectifier's Fifth Generation HEXFETs employ cutting-edge processing processes. With this benefit combined with the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are renowned for, the designe is given an incredibly efficient and dependable device for usage in a number of applications. Its improved thermal properties and multiple-die capacity make the SO-8 perfect for a variety of power applications. This modification was made possible by a specially designed leadframe. This advancement allows for the usage of many devices while drastically reducing the amount of board space needed. Vapor phase infrared, or wave soldering technology is intended for use with the packaging.



IRF7389TRPBF Features


  • Generating Technology V

  • Extremely Low On-Resistant

  • Offering a Free Half Bridge

  • The Surface Mount

  • Complete Avalanche Rating

  • Lead-Free



IRF7389TRPBF Applications


Switching applications


In Stock

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