IRF7311TRPBF

IRF7311TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7311TRPBF
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 9536
  • Description: IRF7311TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Max Power Dissipation 2W
Terminal Form GULL WING
Current Rating 6.6A
Base Part Number IRF7311PBF
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 2W
Turn On Delay Time 8.1 ns
FET Type 2 N-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 29m Ω @ 6A, 4.5V
Vgs(th) (Max) @ Id 700mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 900pF @ 15V
Gate Charge (Qg) (Max) @ Vgs 27nC @ 4.5V
Rise Time 17ns
Fall Time (Typ) 31 ns
Turn-Off Delay Time 38 ns
Continuous Drain Current (ID) 6.6A
Threshold Voltage 700mV
Gate to Source Voltage (Vgs) 12V
Drain to Source Breakdown Voltage 20V
Avalanche Energy Rating (Eas) 100 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
Recovery Time 77 ns
FET Feature Logic Level Gate
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2004
Series HEXFET®
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 29mOhm
Terminal Finish Matte Tin (Sn)
Additional Feature AVALANCHE RATED, ULTRA LOW RESISTANCE
Voltage - Rated DC 20V

IRF7311TRPBF    Description


  International Rectifier's fifth generation HEXFET uses advanced technology to achieve the advantage of extremely low on-resistance per silicon area. Coupled with the well-known fast switching speed and rugged device design of HEXFET Power MOSFET, designers are provided with extremely efficient and reliable devices that can be used in a variety of applications.

The SO-8 has been modified through a custom lead frame to enhance thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications.With these improvements multiple devices that can be used to significantly reduce circuit board space. The package is designed for gas phase infrared or wave soldering technology.

 

IRF7311TRPBF     Features


Generation V Technology

Ultra Low On-Resistance

Dual N-Channel MOSFET Surface Mount

Fully Avalanche Rated

 Lead-Free

 

IRF7311TRPBF      Applications


designers are provided with extremely efficient and reliable devices that can be used in a variety of applications.

 

 





In Stock

Please send RFQ , we will respond immediately.