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IRF7304
  • IRF7304

IRF7304

IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-IRF7304
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 3739
  • Description: IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tube
Published 1997
Series HEXFET®
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LOGIC LEVEL COMPATIBLE
HTS Code 8541.29.00.95
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Number of Elements 2
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode ENHANCEMENT MODE
Power - Max 2W
FET Type 2 P-Channel (Dual)
Rds On (Max) @ Id, Vgs 90m Ω @ 2.2A, 4.5V
Vgs(th) (Max) @ Id 700mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 610pF @ 15V
Current - Continuous Drain (Id) @ 25°C 4.3A
Gate Charge (Qg) (Max) @ Vgs 22nC @ 4.5V
Drain to Source Voltage (Vdss) 20V
Drain Current-Max (Abs) (ID) 3.6A
Drain-source On Resistance-Max 0.09Ohm
DS Breakdown Voltage-Min 20V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
RoHS Status Non-RoHS Compliant

IRF7304    Description

 

  The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.

The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.

 

IRF7304         Features


Generation V Technology

Ultra Low On-Resistance

Dual P-Channel Mosfet Surface Mount

Available in Tape&Reel

Dynamic dv/dt Rating

Fast Switching

 

IRF7304               Applications


provides designers with an extremely efficient device used in a variety of applications.

 



 



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