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| Parameters | |
|---|---|
| Turn-Off Delay Time | 15 ns |
| Continuous Drain Current (ID) | 3A |
| Threshold Voltage | 3V |
| Gate to Source Voltage (Vgs) | 20V |
| Drain Current-Max (Abs) (ID) | 3A |
| Drain to Source Breakdown Voltage | 50V |
| Dual Supply Voltage | 50V |
| FET Technology | METAL-OXIDE SEMICONDUCTOR |
| Recovery Time | 100 ns |
| FET Feature | Standard |
| Nominal Vgs | 3 V |
| Height | 1.4986mm |
| Length | 4.9784mm |
| Width | 3.9878mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead, Lead Free |
| Factory Lead Time | 12 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Number of Pins | 8 |
| Transistor Element Material | SILICON |
| Manufacturer Package Identifier | IRF7103TRPBF |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 1997 |
| Series | HEXFET® |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Resistance | 130mOhm |
| Additional Feature | LOGIC LEVEL COMPATIBLE |
| Subcategory | FET General Purpose Power |
| Voltage - Rated DC | 50V |
| Max Power Dissipation | 2W |
| Terminal Form | GULL WING |
| Current Rating | 3A |
| Base Part Number | IRF7103PBF |
| Number of Elements | 2 |
| Row Spacing | 6.3 mm |
| Element Configuration | Dual |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 2W |
| Turn On Delay Time | 5.1 ns |
| FET Type | 2 N-Channel (Dual) |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 130m Ω @ 3A, 10V |
| Vgs(th) (Max) @ Id | 3V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 290pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs | 30nC @ 10V |
| Rise Time | 8ns |
| Fall Time (Typ) | 25 ns |
IRF7103TRPBF Description
The IRF7103TRPBF is a dual N-channel MOSFET that may be soldered using vapor phase, infrared, or wave methods. It has been updated with a bespoke lead frame for improved thermal performance and dual-die capabilities, making it suitable for a wide range of power applications. Multiple devices can be employed in an application with significantly less board space thanks to these enhancements.
IRF7103TRPBF Features
Advanced process technology
Ultra-low ON-resistance
Surface-mount device
Dynamic dV/dt rating
Fast switching performance
IRF7103TRPBF Applications
Industrial
Power Management
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