IDT74FCT810CTQG8

2 Circuit 100MHz 1:5 Clock Buffer IDT74FCT810 74FCT Series 20-SSOP (0.154, 3.90mm Width)


  • Manufacturer: Renesas Electronics America Inc.
  • NO: 668-IDT74FCT810CTQG8
  • Package: 20-SSOP (0.154, 3.90mm Width)
  • Datasheet: pdf
  • Stock: 8890
  • Description: 2 Circuit 100MHz 1:5 Clock Buffer IDT74FCT810 74FCT Series 20-SSOP (0.154, 3.90mm Width)(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport

SPECIFICATIONS

Parameters
Mounting Type Surface Mount
Package / Case 20-SSOP (0.154, 3.90mm Width)
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Series 74FCT
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fanout Buffer (Distribution)
Voltage - Supply 4.75V~5.25V
Base Part Number IDT74FCT810
Number of Circuits 2
Frequency (Max) 100MHz
Input TTL
Ratio - Input:Output 1:5
Differential - Input:Output No/No

IDT74FCT810CTQG8 Overview


As far as the case type is concerned, the cut smart buffer is available in 20-SSOP (0.154, 3.90mm Width). In case Tape & Reel (TR), the cut smart buffer is available. There is a maximum value of 100MHz for normal operation. If this is the case, it will be mounted as Surface Mount. Electronic parts classified as Fanout Buffer (Distribution) are considered to be safety components. When the temperature is set to 0°C~70°C, reliable performance is ensured. In general, it should be able to work with a power source of 4.75V~5.25V volts. This is a member of the IDT74FCT810 family. The 74FCT series is the name of this electronic component.

IDT74FCT810CTQG8 Features


The operating temperature of 0°C~70°C degrees

IDT74FCT810CTQG8 Applications


There are a lot of Renesas Electronics America Inc. IDT74FCT810CTQG8 Clock Buffers & Drivers applications.

  • Storage area network
  • Mobile Internet Device (MID)
  • Data center
  • Handheld test instruments
  • Edge computing
  • Microserver
  • Tower server
  • FPGA
  • Data communication
  • Machine made

In Stock

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