ICS558AG-02

1 Circuit 250MHz 3.3V Clock Buffer DUAL 16 Pins TSSOP


  • Manufacturer: Integrated Device Technology (IDT)
  • NO: 378-ICS558AG-02
  • Package: TSSOP
  • Datasheet: -
  • Stock: 1846
  • Description: 1 Circuit 250MHz 3.3V Clock Buffer DUAL 16 Pins TSSOP(Kg)

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SPECIFICATIONS

Parameters
Width 4.4mm
RoHS Status RoHS Compliant
Mount Surface Mount
Package / Case TSSOP
Published 1999
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 1
Number of Terminations 16
Terminal Finish TIN LEAD
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Temperature Grade COMMERCIAL
Number of Circuits 1
Frequency (Max) 250MHz
Family 558
Output Characteristics 3-STATE
Input LVHSTL
Logic IC Type LOW SKEW CLOCK DRIVER
Number of True Outputs 4
Length 5mm

ICS558AG-02 Overview


TSSOP case is available for the cut smart buffer. As a rule, the maximum value for normal operation is 250MHz. There are 16 terminations in it. Using a supply voltage of 3.3V allows for high efficiency. There is a place for it in the way of Surface Mount. The pin count is 16. A minimum temperature of 0°C is required for reliability. Temperatures below 70°C allow stable operation. It is part of the 558 family of electronic buffer ICs. This value is set to 3.465V for the maximum available supply voltage (Vsup). In this clock divider, a logic IC with the value LOW SKEW CLOCK DRIVER is used. It is possible to have 4 true outputs.

ICS558AG-02 Features


16 terminations
logic IC type of LOW SKEW CLOCK DRIVER

ICS558AG-02 Applications


There are a lot of Integrated Device Technology (IDT) ICS558AG-02 Clock Buffers & Drivers applications.

  • Medical imaging
  • Tlecom applications
  • Tower server
  • Artificial intelligence
  • Internet of Things
  • Telecommunications
  • Handheld test instruments
  • Cell Phone (UMTS/WCDMA/GSM)
  • Machine made
  • Wireless infrastructure equipment

In Stock

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