ICS556G-03I

1 Circuit 25MHz 1:4 Clock Buffer ICS556-03 16-TSSOP (0.173, 4.40mm Width)


  • Manufacturer: Renesas Electronics America Inc.
  • NO: 668-ICS556G-03I
  • Package: 16-TSSOP (0.173, 4.40mm Width)
  • Datasheet: pdf
  • Stock: 3587
  • Description: 1 Circuit 25MHz 1:4 Clock Buffer ICS556-03 16-TSSOP (0.173, 4.40mm Width)(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport

SPECIFICATIONS

Parameters
Mounting Type Surface Mount
Package / Case 16-TSSOP (0.173, 4.40mm Width)
Operating Temperature 0°C~70°C
Packaging Tube
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fanout Buffer (Distribution)
Voltage - Supply 2.375V~2.625V
Base Part Number ICS556-03
Output LVDS
Number of Circuits 1
Frequency (Max) 25MHz
Input Crystal
Ratio - Input:Output 1:4
Differential - Input:Output No/Yes
RoHS Status Non-RoHS Compliant

ICS556G-03I Overview


It is available in the case 16-TSSOP (0.173, 4.40mm Width) for this cut smart buffer. A Tube is used to package it. It is recommended that the maximum value for normal operation is 25MHz. A mount of Surface Mount has been applied to it. An electronic component classified as Fanout Buffer (Distribution) is categorized as such. The temperature should be set to 0°C~70°C to ensure reliable performance. In general, it should be able to work with a power source of 2.375V~2.625V volts. There is an output of LVDS. This is a member of the family of ICS556-03.

ICS556G-03I Features


The operating temperature of 0°C~70°C degrees

ICS556G-03I Applications


There are a lot of Renesas Electronics America Inc. ICS556G-03I Clock Buffers & Drivers applications.

  • Host bus adapter card
  • Global positioning system (GPS)
  • Patient diagnosis
  • Ultra Mobile PC (UMPC)
  • Furniture
  • DDR4 JEDEC standard LRDIMM design
  • Tower server
  • Wireless infrastructure equipment
  • Mobile Internet Device (MID)
  • Data communication

In Stock

Please send RFQ , we will respond immediately.