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ContactGENERAL ATOMICS UHK17128 REVX2
GENERAL ATOMICS UHK17128 REVX2 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available at Feilidi
- Manufacturer: Bergquist
- NO: 108-GENERAL ATOMICS UHK17128 REVX2
- Package: -
- Datasheet:
- Stock: 9059
- Description: GENERAL ATOMICS UHK17128 REVX2 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available at Feilidi(Kg)
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- Payment:
In Stock
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| Parameters | |
|---|---|
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| RoHS Status | ROHS3 Compliant |
GENERAL ATOMICS UHK17128 REVX2 Description
A practical, thermally conductive interface material is GAP PAD VO. The product is a filled, thermally conductive polymer that is delivered on a fiberglass carrier with a rubber coating for simple material handling. GAP PAD VO can fill up air gaps between PC boards and heat sinks or a metal chassis because of its conformable nature.
GENERAL ATOMICS UHK17128 REVX2 Features
Thermal conductivity: 0.8 W/m-K
Enhanced puncture, shear and tear resistance
Conformable gap filling material
Electrically isolating
GENERAL ATOMICS UHK17128 REVX2 Applications
Telecommunications
Computer and peripherals
Power conversion
Between heat-generating semiconductors and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Between heat-generating magnetic components and a heat sink
