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FP30R06KE3BOSA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available at Feilidi
- Manufacturer: Infineon Technologies
- NO: 376-FP30R06KE3BOSA1
- Package: Module
- Datasheet:
- Stock: 7907
- Description: FP30R06KE3BOSA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available at Feilidi(Kg)
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| Parameters | |
|---|---|
| Number of Terminations | 24 |
| ECCN Code | EAR99 |
| Terminal Position | UPPER |
| Terminal Form | UNSPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 24 |
| Qualification Status | Not Qualified |
| Number of Elements | 7 |
| Configuration | Three Phase Inverter |
| Case Connection | ISOLATED |
| Power - Max | 125W |
| Halogen Free | Not Halogen Free |
| Polarity/Channel Type | N-CHANNEL |
| Input | Standard |
| Collector Emitter Voltage (VCEO) | 600V |
| Max Collector Current | 37A |
| Current - Collector Cutoff (Max) | 1mA |
| Current - Collector (Ic) (Max) | 37A |
| Turn On Time | 170 ns |
| Vce(on) (Max) @ Vge, Ic | 2V @ 15V, 30A |
| Turn Off Time-Nom (toff) | 750 ns |
| IGBT Type | Trench Field Stop |
| NTC Thermistor | Yes |
| Input Capacitance (Cies) @ Vce | 1.65nF @ 25V |
| Height | 17mm |
| Length | 107.5mm |
| Width | 45mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Contains Lead |
| Factory Lead Time | 12 Weeks |
| Contact Plating | Tin |
| Mount | Screw |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Number of Pins | 24 |
| Transistor Element Material | SILICON |
| Operating Temperature | -40°C~150°C |
| Published | 2002 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
FP30R06KE3BOSA1 Description
FP30R06KE3BOSA1 transistor is a MOS field-effect transistor designed to be used in signal applications. The special low thermal resistance packaging makes FP30R06KE3BOSA1 MOSFET suitable for ISM applications in which reliability and durability are essential. It has the common source configuration.
FP30R06KE3BOSA1 Features
Gold metalization
Excellent thermal stability
Common source configuration
Thermally enhanced packaging
FP30R06KE3BOSA1 Applications
ISM applications
DC large signal applications
Power factor correction
Electronic lamp ballasts
Flat panel display
