FF23MR12W1M1B11BOMA1

FF23MR12W1M1B11BOMA1 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi


  • Manufacturer: Infineon Technologies
  • NO: 376-FF23MR12W1M1B11BOMA1
  • Package: Module
  • Datasheet: pdf
  • Stock: 6623
  • Description: FF23MR12W1M1B11BOMA1 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Factory Lead Time 16 Weeks
Mounting Type Chassis Mount
Package / Case Module
Manufacturer Package Identifier AG-EASY1BM-2
Operating Temperature -40°C~150°C TJ
Packaging Tray
Published 2008
Series CoolSiC™+
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Number of Channels 2
Power Dissipation 20mW
Turn On Delay Time 12 ns
FET Type 2 N-Channel (Dual)
Rds On (Max) @ Id, Vgs 23m Ω @ 50A, 15V
Vgs(th) (Max) @ Id 5.55V @ 20mA
Input Capacitance (Ciss) (Max) @ Vds 3950pF @ 800V
Gate Charge (Qg) (Max) @ Vgs 125nC @ 15V
Drain to Source Voltage (Vdss) 1200V 1.2kV
Turn-Off Delay Time 43.5 ns
Continuous Drain Current (ID) 50A
Max Junction Temperature (Tj) 150°C
FET Feature Silicon Carbide (SiC)
Height 12.35mm
RoHS Status ROHS3 Compliant

FF23MR12W1M1B11BOMA1    Description


 FF23MR12W1M1B11BOMA1 is a Easy DUAL Modul mit Cool SiC?Trench MOSFET und Press FIT/NTC.


FF23MR12W1M1B11BOMA1      Applications


·High Frequency Switching application

·DC/DC converter Solar applications

·UPS systems


FF23MR12W1M1B11BOMA1      Features


·High current density

·Low inductive design

·Low switching losses

Integrated NTC temperature sensor

·PressFIT contact technology

Rugged mounting due to integrated mounting clamps



In Stock

Please send RFQ , we will respond immediately.