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| Parameters | |
|---|---|
| Number of Elements | 2 |
| Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE |
| Operating Mode | ENHANCEMENT MODE |
| Power - Max | 1W 1.1W |
| FET Type | 2 N-Channel (Dual) Asymmetrical |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 5m Ω @ 17A, 10V |
| Vgs(th) (Max) @ Id | 3V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 1715pF @ 15V |
| Current - Continuous Drain (Id) @ 25°C | 17A 32A |
| Gate Charge (Qg) (Max) @ Vgs | 24nC @ 10V |
| Drain to Source Voltage (Vdss) | 30V |
| Continuous Drain Current (ID) | 32A |
| Drain Current-Max (Abs) (ID) | 17A |
| Drain-source On Resistance-Max | 0.005Ohm |
| DS Breakdown Voltage-Min | 30V |
| FET Technology | METAL-OXIDE SEMICONDUCTOR |
| FET Feature | Standard |
| Feedback Cap-Max (Crss) | 60 pF |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 23 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 3 days ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-PowerWDFN |
| Number of Pins | 8 |
| Weight | 207.7333mg |
| Transistor Element Material | SILICON |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Series | PowerTrench® |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin (Sn) |
| Max Power Dissipation | 1.1W |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 260 |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
The device includes two specialized N-channel MOSFET in the dual package. The switch nodes are connected internally for easy placement and wiring of synchronous step-down converters. The control of MOSFET (Q1) and synchronous FET (Q2) is designed to provide optimal power efficiency.
Q1 N-Channel
Max. RDS(on) = 5.0 m|? at VGS = 10 V, ID = 17 A
Max. RDS(on) = 6.5 m|? at VGS = 10 V, ID = 17 A
Q2 N-Channel
Max. RDS(on) = 1.6 m|? at VGS = 10 V, ID = 32 A
Max. RDS(on) = 2.0 m|? at VGS = 4.5 V, ID = 28 A
Low Inductance Packaging Shortens Rise/Fall Times, Resulting in Lower Switching Losses
MOSFET Integration Enables Optimum Layout for Lower Circuit Inductance and Reduced Switch Node Ringing
RoHS Compliant
Computing
Communications
General Purpose Point of Load
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