FDMS3660S

FDMS3660S datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available at Feilidi


  • Manufacturer: ON Semiconductor
  • NO: 598-FDMS3660S
  • Package: 8-PowerTDFN
  • Datasheet: pdf
  • Stock: 7440
  • Description: FDMS3660S datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Mounting Type Surface Mount
Package / Case 8-PowerTDFN
Number of Pins 8
Weight 171mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2009
Series PowerTrench®
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Subcategory FET General Purpose Power
Max Power Dissipation 2.5W
Terminal Form FLAT
Base Part Number FDMS3660S
JESD-30 Code R-PDSO-F6
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.5W
Case Connection DRAIN SOURCE
Turn On Delay Time 7.7 ns
Power - Max 1W
FET Type 2 N-Channel (Dual) Asymmetrical
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 8m Ω @ 13A, 10V
Vgs(th) (Max) @ Id 2.7V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1765pF @ 15V
Current - Continuous Drain (Id) @ 25°C 30A 60A
Gate Charge (Qg) (Max) @ Vgs 29nC @ 10V
Turn-Off Delay Time 19 ns
Continuous Drain Current (ID) 30A
Threshold Voltage 1.5V
Gate to Source Voltage (Vgs) 12V
Drain Current-Max (Abs) (ID) 13A
Drain to Source Breakdown Voltage 30V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 1.5 V
Feedback Cap-Max (Crss) 70 pF
Height 1.1mm
Length 5mm
Width 5.9mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Factory Lead Time 13 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact Plating Tin
Mount Surface Mount

FDMS3660S          Description

 

 The device includes two dedicated N-channel MOSFET in a dual PQFN package. The switch nodes are connected internally for easy placement and wiring of synchronous step-down converters. Control MOSFET (Q1) and synchronous synchronous FET (Q2) are designed to provide optimal power efficiency.

 


FDMS3660S             Features


Q1: N?Channel

? Max rDS(on) = 8 m at VGS = 10 V, ID = 13 A

? Max rDS(on) = 11 m at VGS = 4.5 V, ID = 11 A

Q2: N?Channel

? Max rDS(on) = 1.8 m at VGS = 10 V, ID = 30 A

? Max rDS(on) = 2.2 m at VGS = 4.5 V, ID = 27 A

? Low Inductance Packaging Shortens Rise/Fall Times, Resulting in

Lower Switching Losses

? MOSFET Integration Enables Optimum Layout for Lower Circuit

Inductance and Reduced Switch Node Ringing

? These Devices are Pb?Free and are RoHS Compliant


FDMS3660S          Applications


? Computing

? Communications

? General Purpose Point of Load

? Notebook VCORE

 

 





In Stock

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