CYV15G0403DXB-BGXC

256 TerminationsTelecom device4 Circuits


  • Manufacturer: Rochester Electronics
  • NO: 699-CYV15G0403DXB-BGXC
  • Package: 256-LBGA Exposed Pad
  • Datasheet: pdf
  • Stock: 2481
  • Description: 256 TerminationsTelecom device4 Circuits(Kg)

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  • Delivery: Delivery
  • Payment: payment

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FedEx International, 5-7 business days.

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SPECIFICATIONS

Parameters
Mounting Type Surface Mount
Package / Case 256-LBGA Exposed Pad
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Series HOTlink II™
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN SILVER COPPER
Technology BICMOS
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 20
JESD-30 Code S-PBGA-B256
Function Transceiver
Qualification Status COMMERCIAL
Interface LVTTL
Number of Circuits 4
Current - Supply 900mA
Telecom IC Type TELECOM CIRCUIT
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant

CYV15G0403DXB-BGXC Overview


In order to save space on the board, the 256-LBGA Exposed Pad package is used.For packing, Tray is used.Surface Mount is used as telecommunications equipment mounting type.The telecom IC is composed of 4 circuits.Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.The operating temperature set at 0°C~70°C can offer reliable performance.In telecom switching configuration, 256 terminations are present.A 3.3V supply voltage is required to operate it.It uses a TELECOM CIRCUIT type telecom IC.A current of 900mA is used as the supply current.A lot of its functions of the telecommunication product are similar to those of the electronic parts in the HOTlink II? series.

CYV15G0403DXB-BGXC Features


Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type

CYV15G0403DXB-BGXC Applications


There are a lot of Rochester Electronics, LLC CYV15G0403DXB-BGXC Telecom applications.

  • Multi-Line E1 Interface Cards
  • Short/Medium Loop
  • E1 Multiplexer
  • Digital access cross connects
  • E3/DS3 Access Equipment
  • PBX interfaces
  • Digital Cross-Connect Systems
  • ATM equipment with integrated DS1 interfaces
  • T2 Rates PCM Line Interface
  • Hybrid fiber coax (HFC)

In Stock

Please send RFQ , we will respond immediately.