BCP53

BCP53 datasheet pdf and Transistors - Bipolar (BJT) - Single product details from ON Semiconductor stock available at Feilidi

Manufacturer: ON Semiconductor
NO: 598-BCP53
Package: TO-261-4, TO-261AA
Datasheet:
Stock: 9992
Description: BCP53 datasheet pdf and Transistors - Bipolar (BJT) - Single product details from ON Semiconductor stock available at Feilidi(Kg)

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SPECIFICATIONS

Parameters
Number of Pins	3
Weight	188mg
Transistor Element Material	SILICON
Operating Temperature	-55°C~150°C TJ
Packaging	Tape & Reel (TR)
Published	2017
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	4
ECCN Code	EAR99
Subcategory	Other Transistors
Voltage - Rated DC	-80V
Max Power Dissipation	1.5W
Terminal Position	DUAL
Terminal Form	GULL WING
Current Rating	-1.2A
Base Part Number	BCP53
JESD-30 Code	R-PDSO-G4
Number of Elements	1
Element Configuration	Single
Power Dissipation	1.5W
Case Connection	COLLECTOR
Transistor Application	SWITCHING
Gain Bandwidth Product	50MHz
Polarity/Channel Type	PNP
Transistor Type	PNP
Collector Emitter Voltage (VCEO)	-80V
Max Collector Current	1.5A
DC Current Gain (hFE) (Min) @ Ic, Vce	40 @ 150mA 2V
Current - Collector Cutoff (Max)	100nA ICBO
Vce Saturation (Max) @ Ib, Ic	500mV @ 50mA, 500mA
Collector Emitter Breakdown Voltage	80V
Current - Collector (Ic) (Max)	1.2A
Collector Emitter Saturation Voltage	-500mV
Max Breakdown Voltage	80V
Collector Base Voltage (VCBO)	-100V
Emitter Base Voltage (VEBO)	-5V
hFE Min	25
Max Junction Temperature (Tj)	150°C
Height	1.75mm
Length	6.5mm
Width	3.5mm
Radiation Hardening	No
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free
Lifecycle Status	LIFETIME (Last Updated: 5 days ago)
Contact Plating	Tin
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	TO-261-4, TO-261AA

BCP53 Description

The BCP53 is a SOT223 surface-mount plastic package that houses a 1A PNP Medium Power Transistor. It has a heat sink that is exposed for optimum thermal and electrical conductivity. It's built for medium-power surface-mounting applications.

BCP53 Features

High Current: 1.5 Amps
NPN Complement is BCP56
Pb-Free Packages are Available
High power dissipation capability
The SOT‐223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die