859S0412BGILFT

1 Circuit 3GHz 4:2 Clock Buffer 20-TSSOP (0.173, 4.40mm Width)


  • Manufacturer: Renesas Electronics America Inc.
  • NO: 668-859S0412BGILFT
  • Package: 20-TSSOP (0.173, 4.40mm Width)
  • Datasheet: pdf
  • Stock: 2929
  • Description: 1 Circuit 3GHz 4:2 Clock Buffer 20-TSSOP (0.173, 4.40mm Width)(Kg)

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  • Delivery: Delivery
  • Payment: payment

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport

SPECIFICATIONS

Parameters
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Fanout Buffer (Distribution), Multiplexer
Voltage - Supply 2.375V~2.625V 3.135V~3.465V
Output LVDS, LVPECL
Number of Circuits 1
Frequency (Max) 3GHz
Input CML, LVDS, LVPECL
Ratio - Input:Output 4:2
Differential - Input:Output Yes/Yes

859S0412BGILFT Overview


A 20-TSSOP (0.173, 4.40mm Width) case is used for packaging. It is packaged as a Tape & Reel (TR). Normal operation is limited to 3GHz. A mount of Surface Mount has been applied to it. An electronic component classified as Fanout Buffer (Distribution), Multiplexer is categorized as such. The temperature should be set to -40°C~85°C TA to ensure reliable performance. In order for it to function, a power source of 2.375V~2.625V 3.135V~3.465V V must be available. The output is set to LVDS, LVPECL.

859S0412BGILFT Features


The operating temperature of -40°C~85°C TA degrees

859S0412BGILFT Applications


There are a lot of Renesas Electronics America Inc. 859S0412BGILFT Clock Buffers & Drivers applications.

  • High performance communication system
  • DDR4 JEDEC standard LRDIMM design
  • Radar
  • Data center
  • Zero crossing detector
  • OTN
  • Base station
  • Aviation
  • High-speed flip-flop
  • FPGA

In Stock

Please send RFQ , we will respond immediately.