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1 Circuit 200MHz 1:4 Clock Buffer ICS553 ClockBlocks? Series 8-SOIC (0.154, 3.90mm Width)
- Manufacturer: Renesas Electronics America Inc.
- NO: 668-553MLF
- Package: 8-SOIC (0.154, 3.90mm Width)
- Datasheet:
- Stock: 7684
- Description: 1 Circuit 200MHz 1:4 Clock Buffer ICS553 ClockBlocks? Series 8-SOIC (0.154, 3.90mm Width)(Kg)
- Delivery:
- Payment:
In Stock
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Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Supplier Device Package | 8-SOIC |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Series | ClockBlocks™ |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Fanout Buffer (Distribution) |
| Voltage - Supply | 2.375V~5.25V |
| Base Part Number | ICS553 |
| Output | CMOS |
| Number of Circuits | 1 |
| Frequency (Max) | 200MHz |
| Input | CMOS |
| Ratio - Input:Output | 1:4 |
| Differential - Input:Output | No/No |
| RoHS Status | ROHS3 Compliant |
553MLF Overview
The clock divider is available in 8-SOIC (0.154, 3.90mm Width) case. There is a case available for the circuit clock in Tube. In normal operation, the maximum value is set to 200MHz. A mount of Surface Mount has been applied to it. Electronic components classified as Fanout Buffer (Distribution) fall into this category. To ensure reliable performance, the temperature should be set to 0°C~70°C. It should be able to work with a power source of 2.375V~5.25VV. The output is set to CMOS. The structure belongs to the ICS553 family of structures. It belongs to the ClockBlocks? series of electronic parts.
553MLF Features
The operating temperature of 0°C~70°C degrees
553MLF Applications
There are a lot of Renesas Electronics America Inc. 553MLF Clock Buffers & Drivers applications.
- Industrial automation control system
- Big data
- Medical instruments
- Ultra Mobile PC (UMPC)
- Hardware accelerator
- 5G
- Edge computing
- Cell Phone (UMTS/WCDMA/GSM)
- Tlecom applications
- High speed line receiver
